HANMI Semiconductor Co (XKRX:042700) Total Liabilities : ₩173,956 Mil (As of Sep. 2024)

View and export this data going back to 2005. Start your Free Trial

What is HANMI Semiconductor Co Total Liabilities?

HANMI Semiconductor Co's Total Liabilities for the quarter that ended in Sep. 2024 was ₩173,956 Mil.

HANMI Semiconductor Co's quarterly Total Liabilities increased from Mar. 2024 (₩145,826.48 Mil) to Jun. 2024 (₩151,847.01 Mil) and increased from Jun. 2024 (₩151,847.01 Mil) to Sep. 2024 (₩173,956.19 Mil).

HANMI Semiconductor Co's annual Total Liabilities declined from Dec. 2021 (₩82,473.64 Mil) to Dec. 2022 (₩65,336.21 Mil) but then increased from Dec. 2022 (₩65,336.21 Mil) to Dec. 2023 (₩151,940.48 Mil).

HANMI Semiconductor Co Total Liabilities Historical Data

The historical data trend for HANMI Semiconductor Co's Total Liabilities can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

HANMI Semiconductor Co Total Liabilities Chart

HANMI Semiconductor Co Annual Data

Trend

Dec14

Dec15

Dec16

Dec17

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

Total Liabilities

Get a 7-Day Free Trial

37,769.48

69,876.33

82,473.64

65,336.21

151,940.48

HANMI Semiconductor Co Quarterly Data
	Dec19	Mar20	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24	Jun24	Sep24
Total Liabilities	Get a 7-Day Free Trial															79,146.24	151,940.48	145,826.48	151,847.01	173,956.19

HANMI Semiconductor Co Total Liabilities Calculation

Total Liabilities are the liabilities that the company has to pay others. It is a part of the balance sheet of a company that shareholders do not own, and would be obligated to pay back if the company liquidated.

HANMI Semiconductor Co's Total Liabilities for the fiscal year that ended in Dec. 2023 is calculated as

Total Liabilities	=	Total Current Liabilities	+	Total Noncurrent Liabilities
	=	Total Current Liabilities	+	(Long-Term Debt & Capital Lease Obligation	+	Other Long-Term Liabilities
	=	105009.651	+	(467.41	+	45903.296
	+	NonCurrent Deferred Liabilities	+	PensionAndRetirementBenefit)
	+	0	+	560.122)
	=	151,940

Total Liabilities	=	Total Assets (A: Dec. 2023 )	-	Total Equity (A: Dec. 2023 )
	=	723839.104	-	571898.625
	=	151,940

HANMI Semiconductor Co's Total Liabilities for the quarter that ended in Sep. 2024 is calculated as

Total Liabilities	=	Total Current Liabilities	+	Total Noncurrent Liabilities
	=	Total Current Liabilities	+	(Long-Term Debt & Capital Lease Obligation	+	Other Long-Term Liabilities
	=	153629.354	+	(1686.099	+	16794.583
	+	NonCurrent Deferred Liabilities	+	PensionAndRetirementBenefit)
	+	0	+	1846.156)
	=	173,956

Total Liabilities	=	Total Assets (Q: Sep. 2024 )	-	Total Equity (Q: Sep. 2024 )
	=	724965.834	-	551009.642
	=	173,956

HANMI Semiconductor Co Total Liabilities Related Terms

Thank you for viewing the detailed overview of HANMI Semiconductor Co's Total Liabilities provided by GuruFocus.com. Please click on the following links to see related term pages.

HANMI Semiconductor Co Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » HANMI Semiconductor Co Ltd (XKRX:042700) » Definitions » Total Liabilities

Traded in Other Exchanges

N/A

Address

532-2 Gajwa-Dong, Seo-gu, Incheon, KOR, 404-250

Website

http://www.hanmisemi.com

HANMI Semiconductor Co Ltd operates in semiconductor equipment business. The company has the largest worldwide market share for sewing and placement system. Its product portfolio divides into three main segments: Semiconductor Equipment, Laser Application Processes, PV and LED. Semiconductor division offer equipment such as singulation, flip chip binder, molding, trim and form, marking, inspection, pick and place, attach and detach, and PCB equipment. Laser Application Processes comprises laser marking, laser ablation, laser cutting and singulation as well as reel to reel laser. PV and LED offer equipment including PV brick IR inspection, PV wafer inspection, LED manual mold, among others.

HANMI Semiconductor Co Headlines

No Headlines