Global Unichip (TPE:3443) Change In Receivables : NT$-173 Mil (TTM As of Dec. 2024)

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What is Global Unichip Change In Receivables?

Global Unichip's change in receivables for the quarter that ended in Dec. 2024 was NT$54 Mil. It means Global Unichip's Accounts Receivable declined by NT$54 Mil from Sep. 2024 to Dec. 2024 .

Global Unichip's change in receivables for the fiscal year that ended in Dec. 2024 was NT$-173 Mil. It means Global Unichip's Accounts Receivable increased by NT$173 Mil from Dec. 2023 to Dec. 2024 .

Global Unichip's Accounts Receivable for the quarter that ended in Dec. 2024 was NT$2,007 Mil.

Days Sales Outstanding measures of the average number of days that a company takes to collect revenue after a sale has been made. It is a financial ratio that illustrates how well a company's Accounts Receivable are being managed. Global Unichip's Days Sales Outstanding for the three months ended in Dec. 2024 was 30.41.

In Ben Graham's calculation of liquidation value, Apple Inc's Accounts Receivable are only considered to be worth 75% of book value. Global Unichip's liquidation value for the three months ended in Dec. 2024 was NT$1,302 Mil.

Global Unichip Change In Receivables Historical Data

The historical data trend for Global Unichip's Change In Receivables can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Global Unichip Change In Receivables Chart

Global Unichip Annual Data

Trend

Dec15

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Dec24

Change In Receivables

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550.49

-318.69

-1,487.18

1,010.81

-173.14

Global Unichip Quarterly Data
	Mar20	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24	Jun24	Sep24	Dec24
Change In Receivables	Get a 7-Day Free Trial															50.52	346.17	-274.92	-298.34	53.95

Global Unichip Change In Receivables Calculation

Change In Accounts Receivable relative to the previous period. It is any increase or decrease in the cash a company is owed by its customers.

Change In Receivables for the trailing twelve months (TTM) ended in Dec. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was NT$-173 Mil.

Global Unichip (TPE:3443) Change In Receivables Explanation

1. Accounts Receivable are created when a customer has received a product but has not yet paid for that product. Days Sales Outstanding measures of the average number of days that a company takes to collect revenue after a sale has been made. It is a financial ratio that illustrates how well a company's Accounts Receivable are being managed.

Global Unichip's Days Sales Outstanding for the quarter that ended in Dec. 2024 is calculated as:

	Days Sales Outstanding
=	Accounts Receivable	/	Revenue	*	Days in Period
=	2007.396	/	6022.643	*	91
=	30.41

2. In Ben Graham's calculation of liquidation value, Global Unichip's accounts receivable are only considered to be worth 75% of book value:

Global Unichip's liquidation value for the quarter that ended in Dec. 2024 is calculated as:

	Liquidation Value
=	Cash, Cash Equivalents, Marketable Securities	-	Total Liabilities	+	(0.75 * Accounts Receivable)	+	(0.5 * Total Inventories)
=	13413.732	-	15014.98	+	0.75 * 2007.396	+	0.5 * 2794.441
=	1,302

Global Unichip Change In Receivables Related Terms

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Global Unichip Business Description

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Address

No. 10, Li-Hsin 6th Road, Hsinchu Science Park, Hsinchu, TWN, 300096

Website

https://www.guc-asic.com

Global Unichip Corp is a company engaged in researching, developing, producing, testing, and selling of embedded memory and logic components for various application ICs, cell libraries for various applications ICs, and EDA tools for various application ICs. It is a market leader in ASIC (application-specific integrated circuit) services. It's comprehensive design services include spec-in and SoC (System-on-Chip) integration, physical implementation, latest packaging technology, is, turn-key manufacturing, as well as cutting-edge technologies such as world-class HBM (high-bandwidth memory) and die-to-die interconnect IPs etc.

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