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Global Unichip (TPE:3443) Debt-to-Revenue : 0.01 (As of Mar. 2025)


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What is Global Unichip Debt-to-Revenue?

Debt-to-Revenue measures a company's ability to pay off its debt.

Global Unichip's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2025 was NT$69 Mil. Global Unichip's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2025 was NT$112 Mil. Global Unichip's annualized Revenue for the quarter that ended in Mar. 2025 was NT$28,095 Mil. Global Unichip's annualized Debt-to-Revenue for the quarter that ended in Mar. 2025 was 0.01.


Global Unichip Debt-to-Revenue Historical Data

The historical data trend for Global Unichip's Debt-to-Revenue can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Global Unichip Debt-to-Revenue Chart

Global Unichip Annual Data
Trend Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23 Dec24
Debt-to-Revenue
Get a 7-Day Free Trial Premium Member Only Premium Member Only 0.02 0.02 0.01 0.01 0.01

Global Unichip Quarterly Data
Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24 Dec24 Mar25
Debt-to-Revenue Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 0.01 0.01 0.01 0.01 0.01

Competitive Comparison of Global Unichip's Debt-to-Revenue

For the Semiconductors subindustry, Global Unichip's Debt-to-Revenue, along with its competitors' market caps and Debt-to-Revenue data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Global Unichip's Debt-to-Revenue Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, Global Unichip's Debt-to-Revenue distribution charts can be found below:

* The bar in red indicates where Global Unichip's Debt-to-Revenue falls into.


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Global Unichip Debt-to-Revenue Calculation

Debt-to-Revenue measures a company's ability to pay off its debt.

Global Unichip's Debt-to-Revenue for the fiscal year that ended in Dec. 2024 is calculated as

Debt-to-Revenue=Total Debt / Revenue
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Revenue
=(76.965 + 109.596) / 25044.192
=0.01

Global Unichip's annualized Debt-to-Revenue for the quarter that ended in Mar. 2025 is calculated as

Debt-to-Revenue=Total Debt / Revenue
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Revenue
=(68.631 + 112.076) / 28094.576
=0.01

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

In the calculation of annual Debt-to-Revenue, the Revenue of the last fiscal year is used. In calculating the annualized quarterly data, the Revenue data used here is four times the quarterly (Mar. 2025) Revenue data.


Global Unichip Debt-to-Revenue Related Terms

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Global Unichip Business Description

Traded in Other Exchanges
N/A
Address
No. 10, Li-Hsin 6th Road, Hsinchu Science Park, Hsinchu, TWN, 300096
Global Unichip Corp is a company engaged in researching, developing, producing, testing, and selling of embedded memory and logic components for various application ICs, cell libraries for various applications ICs, and EDA tools for various application ICs. It is a market leader in ASIC (application-specific integrated circuit) services. It's comprehensive design services include spec-in and SoC (System-on-Chip) integration, physical implementation, latest packaging technology, is, turn-key manufacturing, as well as cutting-edge technologies such as world-class HBM (high-bandwidth memory) and die-to-die interconnect IPs etc.

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