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Global Unichip (TPE:3443) Buildings And Improvements : NT$0 Mil (As of Mar. 2025)


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What is Global Unichip Buildings And Improvements?

Global Unichip Buildings And Improvements Historical Data

The historical data trend for Global Unichip's Buildings And Improvements can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Global Unichip Buildings And Improvements Chart

Global Unichip Annual Data
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Buildings And Improvements
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Global Unichip Quarterly Data
Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24 Dec24 Mar25
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Global Unichip Buildings And Improvements Calculation

Buildings are typically valued at the time of acquisition or construction.  Broker and architect fees, permits, etc. can be covered within this category.  Building components, such as a roof, are normally recorded separately in an asset register since the value and useful lives of these components equal much less than the building itself.

Building improvements that extend the useful life of a building will fall into the category of “building improvements” and should be capitalized.  Improvements are commonly recorded at acquisition cost.  Building improvement examples include roofing, remodeling, replacements, etc.

Global Unichip Business Description

Industry
GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Global Unichip Corp (TPE:3443) » Definitions » Buildings And Improvements
Comparable Companies
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Traded in Other Exchanges
N/A
Address
No. 10, Li-Hsin 6th Road, Hsinchu Science Park, Hsinchu, TWN, 300096
Website
https://www.guc-asic.com
Global Unichip Corp is a company engaged in researching, developing, producing, testing, and selling of embedded memory and logic components for various application ICs, cell libraries for various applications ICs, and EDA tools for various application ICs. It is a market leader in ASIC (application-specific integrated circuit) services. It's comprehensive design services include spec-in and SoC (System-on-Chip) integration, physical implementation, latest packaging technology, is, turn-key manufacturing, as well as cutting-edge technologies such as world-class HBM (high-bandwidth memory) and die-to-die interconnect IPs etc.

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