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Global Unichip (TPE:3443) Issuance of Debt : NT$0 Mil (TTM As of Sep. 2024)


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What is Global Unichip Issuance of Debt?

Global Unichip's Issuance of Debt for the three months ended in Sep. 2024 was NT$0 Mil.

Global Unichip's Issuance of Debt for the trailing twelve months (TTM) ended in Sep. 2024 was NT$0 Mil.


Global Unichip Issuance of Debt Historical Data

The historical data trend for Global Unichip's Issuance of Debt can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Global Unichip Issuance of Debt Chart

Global Unichip Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Issuance of Debt
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Global Unichip Quarterly Data
Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24
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Global Unichip Issuance of Debt Calculation

Issuance of Debt represents all the cash inflow from debt, including both long-term debt and short-term debt.

Issuance of Debt for the trailing twelve months (TTM) ended in Sep. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was NT$0 Mil.

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Global Unichip Issuance of Debt Related Terms

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Global Unichip Business Description

Traded in Other Exchanges
N/A
Address
No. 10, Li-Hsin 6th Road, Hsinchu Science Park, Hsinchu, TWN, 300096
Global Unichip Corp is a Taiwanese fabless application-specific integrated circuit (ASIC) design company that provides several services, including system-on-chip integration, implementation methodologies, and integrated manufacturing. The company offers its manufacturing service through collaboration with wafer fabs, packaging and testing houses, and other providers to shorten time to market, minimize technical risk, and improve yield for customers. The company also touts an extensive IP product portfolio that enables the adoption of emerging technologies and interfaces, while also reducing time to market.

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