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Global Unichip (TPE:3443) Valuation Rank


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What is Global Unichip Valuation Rank?

The Valuation Rank measures the current valuation of a business relative to other companies in the same industry and its own historical valuation. The companies are split in equal numbers and then ranked from 1 to 10, with 10 as the most undervalued and 1 as the most overvalued.

  1. Three factors:
    • Absolute valuation (medpsvalue) relative to current stock price, rank among all companies
    • Historical valuation over the past 10 years. Rank pe, ps, pocf, ev2ebit over their own historical values
    • Industry relative valuation
  2. Companies without enough data is not ranked
  3. Companies with negative earnings are ranked lower

These three factors are used to calculate the value score for every eligible company, with values from 1 to 10. The final ranked companies are split in equal numbers and ranked from 1 to 10, with 10 as the most undervalued, and 1 as the most overvalued. The numbers of companies in each rank are the same.

Global Unichip Valuation Rank Related Terms

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Global Unichip Business Description

Industry
GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Global Unichip Corp (TPE:3443) » Definitions » Valuation Rank
Comparable Companies
ROCO:5347 TPE:6415 ROCO:6488 TPE:5269 ROCO:3529 ROCO:5274 TPE:2449 TPE:2408 TPE:6526 ROCO:8299 NVDA AVGO TPE:2330 TXN QCOM AMD ADI MU INTC XKRX:000660
Traded in Other Exchanges
N/A
Address
No. 10, Li-Hsin 6th Road, Hsinchu Science Park, Hsinchu, TWN, 300096
Website
https://www.guc-asic.com
Global Unichip Corp is a company engaged in researching, developing, producing, testing, and selling of embedded memory and logic components for various application ICs, cell libraries for various applications ICs, and EDA tools for various application ICs. It is a market leader in ASIC (application-specific integrated circuit) services. It's comprehensive design services include spec-in and SoC (System-on-Chip) integration, physical implementation, latest packaging technology, is, turn-key manufacturing, as well as cutting-edge technologies such as world-class HBM (high-bandwidth memory) and die-to-die interconnect IPs etc.