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Formosa Advanced Technologies Co (TPE:8131) Construction In Progress : NT$0 Mil (As of Mar. 2025)


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What is Formosa Advanced Technologies Co Construction In Progress?


Formosa Advanced Technologies Co Construction In Progress Historical Data

The historical data trend for Formosa Advanced Technologies Co's Construction In Progress can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Formosa Advanced Technologies Co Construction In Progress Chart

Formosa Advanced Technologies Co Annual Data
Trend Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23 Dec24
Construction In Progress
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Formosa Advanced Technologies Co Quarterly Data
Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24 Dec24 Mar25
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Formosa Advanced Technologies Co Construction In Progress Calculation

It records the cost of construction work, which is not yet completed (typically, applied to capital budget items). A construction in progress item is not depreciated until the asset is placed in service. Normally, upon completion, a construction in progress item is reclassified, and the reclassified asset is capitalized and depreciated.


Formosa Advanced Technologies Co Business Description

Traded in Other Exchanges
N/A
Address
No.329, Henan Street, Liuzhong Viliage, Yunlin County, Douliu, TWN, 640
Formosa Advanced Technologies Co Ltd is a professional manufacturer of DRAM assembly, testing, and module Turn-Key service in Taiwan. Its operations include packaging, testing, processing, and research and development of integrated chips. The group's business activity is operated in Taiwan, USA, China, Korea, and Others. It provides services applied in thin small-outline packages (TSOPs), quad flat packages (QFPs), ball grid array (BGA) packages, chip probing (CP) testing, solid-state disk (SSD) testing, system-in-package (SIP) testing, embedded multimedia card (eMMC) testing, as well as cutting, grinding and testing of light-emitting diodes (LED) wafers, among others.

Formosa Advanced Technologies Co Headlines

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