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Formosa Advanced Technologies Co (TPE:8131) ROE % Adjusted to Book Value : 4.58% (As of Dec. 2024)


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What is Formosa Advanced Technologies Co ROE % Adjusted to Book Value?

Formosa Advanced Technologies Co's ROE % for the quarter that ended in Dec. 2024 was 5.27%. Formosa Advanced Technologies Co's PB Ratio for the quarter that ended in Dec. 2024 was 1.15. Formosa Advanced Technologies Co's ROE % Adjusted to Book Value for the quarter that ended in Dec. 2024 was 4.58%.


Formosa Advanced Technologies Co ROE % Adjusted to Book Value Historical Data

The historical data trend for Formosa Advanced Technologies Co's ROE % Adjusted to Book Value can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Formosa Advanced Technologies Co ROE % Adjusted to Book Value Chart

Formosa Advanced Technologies Co Annual Data
Trend Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23 Dec24
ROE % Adjusted to Book Value
Get a 7-Day Free Trial Premium Member Only Premium Member Only 8.56 9.16 12.35 2.97 6.90

Formosa Advanced Technologies Co Quarterly Data
Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24 Dec24
ROE % Adjusted to Book Value Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 0.56 8.48 6.64 3.04 4.58

Competitive Comparison of Formosa Advanced Technologies Co's ROE % Adjusted to Book Value

For the Semiconductors subindustry, Formosa Advanced Technologies Co's ROE % Adjusted to Book Value, along with its competitors' market caps and ROE % Adjusted to Book Value data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Formosa Advanced Technologies Co's ROE % Adjusted to Book Value Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, Formosa Advanced Technologies Co's ROE % Adjusted to Book Value distribution charts can be found below:

* The bar in red indicates where Formosa Advanced Technologies Co's ROE % Adjusted to Book Value falls into.


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Formosa Advanced Technologies Co ROE % Adjusted to Book Value Calculation

Formosa Advanced Technologies Co's ROE % Adjusted to Book Value for the fiscal year that ended in Dec. 2024 is calculated as

ROE % Adjusted to Book Value=ROE % / PB Ratio
=7.93% / 1.15
=6.90%

Formosa Advanced Technologies Co's ROE % Adjusted to Book Value for the quarter that ended in Dec. 2024 is calculated as

ROE % Adjusted to Book Value=ROE % / PB Ratio
=5.27% / 1.15
=4.58%

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


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Formosa Advanced Technologies Co Business Description

Traded in Other Exchanges
N/A
Address
No.329, Henan Street, Douliu, TWN, 640
Formosa Advanced Technologies Co Ltd is a professional manufacturer of DRAM assembly, testing and module Turn-Key service in Taiwan. Its operations include the packaging, testing, processing, and research and development of integrated chips. The group's business activity is operated in Taiwan, Hong Kong, and South Korea. It provides services applied in thin small-outline packages (TSOPs), quad flat packages (QFPs), ball grid array (BGA) packages, chip probing (CP) testing, solid-state disk (SSD) testing, system-in-package (SIP) testing, embedded multimedia card (eMMC) testing, as well as cutting, grinding and testing of light-emitting diodes (LED) wafers, among others.

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