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Formosa Advanced Technologies Co (TPE:8131) Buildings And Improvements : NT$0 Mil (As of Mar. 2025)


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What is Formosa Advanced Technologies Co Buildings And Improvements?

Formosa Advanced Technologies Co Buildings And Improvements Historical Data

The historical data trend for Formosa Advanced Technologies Co's Buildings And Improvements can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Formosa Advanced Technologies Co Buildings And Improvements Chart

Formosa Advanced Technologies Co Annual Data
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Buildings And Improvements
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Formosa Advanced Technologies Co Quarterly Data
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Formosa Advanced Technologies Co Buildings And Improvements Calculation

Buildings are typically valued at the time of acquisition or construction.  Broker and architect fees, permits, etc. can be covered within this category.  Building components, such as a roof, are normally recorded separately in an asset register since the value and useful lives of these components equal much less than the building itself.

Building improvements that extend the useful life of a building will fall into the category of “building improvements” and should be capitalized.  Improvements are commonly recorded at acquisition cost.  Building improvement examples include roofing, remodeling, replacements, etc.

Formosa Advanced Technologies Co Business Description

Industry
GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Formosa Advanced Technologies Co Ltd (TPE:8131) » Definitions » Buildings And Improvements
Comparable Companies
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Traded in Other Exchanges
N/A
Address
No.329, Henan Street, Liuzhong Viliage, Yunlin County, Douliu, TWN, 640
Website
https://www.fatc.com.tw
Formosa Advanced Technologies Co Ltd is a professional manufacturer of DRAM assembly, testing, and module Turn-Key service in Taiwan. Its operations include packaging, testing, processing, and research and development of integrated chips. The group's business activity is operated in Taiwan, USA, China, Korea, and Others. It provides services applied in thin small-outline packages (TSOPs), quad flat packages (QFPs), ball grid array (BGA) packages, chip probing (CP) testing, solid-state disk (SSD) testing, system-in-package (SIP) testing, embedded multimedia card (eMMC) testing, as well as cutting, grinding and testing of light-emitting diodes (LED) wafers, among others.

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