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Formosa Advanced Technologies Co (TPE:8131) Valuation Rank


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What is Formosa Advanced Technologies Co Valuation Rank?

The Valuation Rank measures the current valuation of a business relative to other companies in the same industry and its own historical valuation. The companies are split in equal numbers and then ranked from 1 to 10, with 10 as the most undervalued and 1 as the most overvalued.

  1. Three factors:
    • Absolute valuation (medpsvalue) relative to current stock price, rank among all companies
    • Historical valuation over the past 10 years. Rank pe, ps, pocf, ev2ebit over their own historical values
    • Industry relative valuation
  2. Companies without enough data is not ranked
  3. Companies with negative earnings are ranked lower

These three factors are used to calculate the value score for every eligible company, with values from 1 to 10. The final ranked companies are split in equal numbers and ranked from 1 to 10, with 10 as the most undervalued, and 1 as the most overvalued. The numbers of companies in each rank are the same.

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Formosa Advanced Technologies Co Business Description

Industry
GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Formosa Advanced Technologies Co Ltd (TPE:8131) » Definitions » Valuation Rank
Comparable Companies
TPE:3712 ROCO:6138 ROCO:6104 ROCO:5425 ROCO:6640 ROCO:6679 ROCO:3228 TPE:6202 TPE:2401 TPE:3545 NVDA AVGO TPE:2330 QCOM AMD TXN ADI INTC MU XKRX:000660
Traded in Other Exchanges
N/A
Address
No.329, Henan Street, Douliu, TWN, 640
Website
https://www.fatc.com.tw
Formosa Advanced Technologies Co Ltd is a professional manufacturer of DRAM assembly, testing and module Turn-Key service in Taiwan. Its operations include the packaging, testing, processing, and research and development of integrated chips. The group's business activity is operated in Taiwan, Hong Kong, and South Korea. It provides services applied in thin small-outline packages (TSOPs), quad flat packages (QFPs), ball grid array (BGA) packages, chip probing (CP) testing, solid-state disk (SSD) testing, system-in-package (SIP) testing, embedded multimedia card (eMMC) testing, as well as cutting, grinding and testing of light-emitting diodes (LED) wafers, among others.