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Formosa Advanced Technologies Co (TPE:8131) LT-Debt-to-Total-Asset : 0.04 (As of Dec. 2024)


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What is Formosa Advanced Technologies Co LT-Debt-to-Total-Asset?

LT Debt to Total Assets is a measurement representing the percentage of a corporation's assets that are financed with loans and financial obligations lasting more than one year. The ratio provides a general measure of the financial position of a company, including its ability to meet financial requirements for outstanding loans. It is calculated as a company's Long-Term Debt & Capital Lease Obligationdivide by its Total Assets. Formosa Advanced Technologies Co's long-term debt to total assests ratio for the quarter that ended in Dec. 2024 was 0.04.

Formosa Advanced Technologies Co's long-term debt to total assets ratio declined from Dec. 2023 (0.04) to Dec. 2024 (0.04). It may suggest that Formosa Advanced Technologies Co is progressively becoming less dependent on debt to grow their business.


Formosa Advanced Technologies Co LT-Debt-to-Total-Asset Historical Data

The historical data trend for Formosa Advanced Technologies Co's LT-Debt-to-Total-Asset can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Formosa Advanced Technologies Co LT-Debt-to-Total-Asset Chart

Formosa Advanced Technologies Co Annual Data
Trend Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23 Dec24
LT-Debt-to-Total-Asset
Get a 7-Day Free Trial Premium Member Only Premium Member Only 0.03 0.03 0.04 0.04 0.04

Formosa Advanced Technologies Co Quarterly Data
Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24 Dec24
LT-Debt-to-Total-Asset Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 0.04 0.04 0.03 0.04 0.04

Formosa Advanced Technologies Co LT-Debt-to-Total-Asset Calculation

Formosa Advanced Technologies Co's Long-Term Debt to Total Asset Ratio for the fiscal year that ended in Dec. 2024 is calculated as

LT Debt to Total Assets (A: Dec. 2024 )=Long-Term Debt & Capital Lease Obligation (A: Dec. 2024 )/Total Assets (A: Dec. 2024 )
=436.499/12523.724
=0.03

Formosa Advanced Technologies Co's Long-Term Debt to Total Asset Ratio for the quarter that ended in Dec. 2024 is calculated as

LT Debt to Total Assets (Q: Dec. 2024 )=Long-Term Debt & Capital Lease Obligation (Q: Dec. 2024 )/Total Assets (Q: Dec. 2024 )
=436.499/12523.724
=0.03

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Formosa Advanced Technologies Co  (TPE:8131) LT-Debt-to-Total-Asset Explanation

LT Debt to Total Asset is a measurement representing the percentage of a corporation's assets that are financed with loans and financial obligations lasting more than one year. The ratio provides a general measure of the financial position of a company, including its ability to meet financial requirements for outstanding loans. A year-over-year decrease in this metric would suggest the company is progressively becoming less dependent on debt to grow their business.


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Formosa Advanced Technologies Co Business Description

Traded in Other Exchanges
N/A
Address
No.329, Henan Street, Douliu, TWN, 640
Formosa Advanced Technologies Co Ltd is a professional manufacturer of DRAM assembly, testing and module Turn-Key service in Taiwan. Its operations include the packaging, testing, processing, and research and development of integrated chips. The group's business activity is operated in Taiwan, Hong Kong, and South Korea. It provides services applied in thin small-outline packages (TSOPs), quad flat packages (QFPs), ball grid array (BGA) packages, chip probing (CP) testing, solid-state disk (SSD) testing, system-in-package (SIP) testing, embedded multimedia card (eMMC) testing, as well as cutting, grinding and testing of light-emitting diodes (LED) wafers, among others.

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