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HYTC Co (XKRX:148930) Issuance of Debt : ₩0 Mil (TTM As of Dec. 2024)


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What is HYTC Co Issuance of Debt?

HYTC Co's Issuance of Debt for the three months ended in Dec. 2024 was ₩0 Mil.

HYTC Co's Issuance of Debt for the trailing twelve months (TTM) ended in Dec. 2024 was ₩0 Mil.


HYTC Co Issuance of Debt Historical Data

The historical data trend for HYTC Co's Issuance of Debt can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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HYTC Co Issuance of Debt Chart

HYTC Co Annual Data
Trend Dec11 Dec12 Dec19 Dec20 Dec21 Dec22 Dec23 Dec24
Issuance of Debt
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HYTC Co Quarterly Data
Dec11 Dec12 Dec19 Dec20 Mar21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24 Dec24
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HYTC Co Issuance of Debt Calculation

Issuance of Debt represents all the cash inflow from debt, including both long-term debt and short-term debt.

Issuance of Debt for the trailing twelve months (TTM) ended in Dec. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was ₩0 Mil.

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


HYTC Co Issuance of Debt Related Terms

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HYTC Co Business Description

Traded in Other Exchanges
N/A
Address
9-14, Sanbon-ro, 101 beon-gil, Gyeonggi-do, Gunpo-si, KOR
HYTC Co Ltd operates an electronic component development business. The company specializes in the production of ultra-precision parts for secondary battery manufacturing equipment. Its product portfolio comprises ultra-precision parts such as semiconductors, LED molds, and secondary battery parts, PX-Shaft, Knife Unit, and Knife-Spacer used in plate processing equipment, cores used in assembly processing equipment, insulating plate mold, cutter, ultrasonic horn, etc.

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