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Sunflex Technology (ROCO:3390) Debt-to-Asset : 0.14 (As of Mar. 2025)


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What is Sunflex Technology Debt-to-Asset?

Sunflex Technology's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2025 was NT$96.5 Mil. Sunflex Technology's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2025 was NT$189.8 Mil. Sunflex Technology's Long-Term Debt & Capital Lease ObligationTotal Assets for the quarter that ended in Mar. 2025 was NT$1,985.2 Mil. Sunflex Technology's debt to asset for the quarter that ended in Mar. 2025 was 0.14.


Sunflex Technology Debt-to-Asset Historical Data

The historical data trend for Sunflex Technology's Debt-to-Asset can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Sunflex Technology Debt-to-Asset Chart

Sunflex Technology Annual Data
Trend Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23 Dec24
Debt-to-Asset
Get a 7-Day Free Trial Premium Member Only Premium Member Only 0.34 0.32 0.33 0.24 0.01

Sunflex Technology Quarterly Data
Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24 Dec24 Mar25
Debt-to-Asset Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 0.24 0.20 0.01 0.01 0.14

Competitive Comparison of Sunflex Technology's Debt-to-Asset

For the Electronic Components subindustry, Sunflex Technology's Debt-to-Asset, along with its competitors' market caps and Debt-to-Asset data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Sunflex Technology's Debt-to-Asset Distribution in the Hardware Industry

For the Hardware industry and Technology sector, Sunflex Technology's Debt-to-Asset distribution charts can be found below:

* The bar in red indicates where Sunflex Technology's Debt-to-Asset falls into.


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Sunflex Technology Debt-to-Asset Calculation

Debt to Asset measures the financial leverage a company has.

Sunflex Technology's Debt-to-Asset for the fiscal year that ended in Dec. 2024 is calculated as

Debt-to-Asset=Total Debt / Total Assets
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Total Assets
=(7.072 + 3.936) / 1478.733
=0.01

Sunflex Technology's Debt-to-Asset for the quarter that ended in Mar. 2025 is calculated as

Debt-to-Asset=Total Debt / Total Assets
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Total Assets
=(96.538 + 189.767) / 1985.235
=0.14

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Sunflex Technology  (ROCO:3390) Debt-to-Asset Explanation

In the calculation of Debt-to-Asset, we use the total of Short-Term Debt & Capital Lease Obligation and Long-Term Debt & Capital Lease Obligation divided by Total Assets.


Sunflex Technology Debt-to-Asset Related Terms

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Sunflex Technology Business Description

Traded in Other Exchanges
N/A
Address
No. 522, Nanshang Road, Guishan District, Taoyuan, TWN, 333014
Sunflex Technology Corp manufactures and markets flexible printed circuit boards (FPCBs). It provides single and double-sided flexible PCBs that are applied in the manufacturing of mobile phones, notebook computers, disk players, and LCDs. The company applications include touch panels, liquid crystal module, computer accessories, and a light bar. The Company's operating revenue is mainly derived from the production and sales of customized flexible circuit boards.

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