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Black Sesame International Holding (HKSE:02533) Total Payout Yield % : -0.01 (As of Dec. 14, 2024)


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What is Black Sesame International Holding Total Payout Yield %?

Total Payout Yield % is the percent a company has paid to its shareholders through net repurchases of shares and dividends based on its Market Cap. It is a measure of shareholder return.

Black Sesame International Holding's current Total Payout Yield % is -0.01%.


Black Sesame International Holding Total Payout Yield % Historical Data

The historical data trend for Black Sesame International Holding's Total Payout Yield % can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Black Sesame International Holding Total Payout Yield % Chart

Black Sesame International Holding Annual Data
Trend Dec21 Dec22 Dec23
Total Payout Yield %
- - -

Black Sesame International Holding Semi-Annual Data
Dec21 Dec22 Dec23
Total Payout Yield % - - -

Competitive Comparison of Black Sesame International Holding's Total Payout Yield %

For the Semiconductors subindustry, Black Sesame International Holding's Total Payout Yield %, along with its competitors' market caps and Total Payout Yield % data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Black Sesame International Holding's Total Payout Yield % Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, Black Sesame International Holding's Total Payout Yield % distribution charts can be found below:

* The bar in red indicates where Black Sesame International Holding's Total Payout Yield % falls into.



Black Sesame International Holding Total Payout Yield % Calculation

Total Payout Yield % is a measure of shareholder return.

Black Sesame International Holding's Total Payout Yield % for the fiscal year that ended in Dec. 2023 is calculated as

Total Payout Yield %=- (Repurchase of Stock + Issuance of Stock + Cash Flow for Dividends) / Market Cap
=- (0 + 1.968 + 0) / 0
=N/A%

Black Sesame International Holding's annualized Total Payout Yield % for the quarter that ended in Dec. 2023 is calculated as

Total Payout Yield %=- (Repurchase of Stock + Issuance of Stock + Cash Flow for Dividends) * Annualized Factor / Market Cap
=- (0 + 1.968 + 0) * 1 / 0
=N/A%

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Black Sesame International Holding Total Payout Yield % Explanation

Similar to Dividend Yield, Total Payout Yield % is a measurement of shareholder return. Dividends is not the only way that companies are able to distribute their excess cash back to the shareholders. The other way to distribute the cash is a stock repurchase. The stock repurchase buys back the company's own shares from the marketplace. This results in a reduced number of oustanding shares, making each share worth a greater percentage of the corporation.


Black Sesame International Holding Total Payout Yield % Related Terms

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Black Sesame International Holding Business Description

Comparable Companies
Traded in Other Exchanges
N/A
Address
1278 Heping Avenue, 32nd floor, Shenzhen State Investment Center, Qingshan District, Wuhan, CHN
Black Sesame International Holding Ltd is an automotive-grade computing SoC and SoC-based intelligent vehicle solution provider with a mission to drive the future of mobility with chips. SoC is an integrated circuit that integrates key electronic components including central processing units, memories, I/O interfaces and others. It has designed two series of automotive-grade SoCs, the Huashan Series high-computing power SoCs and the Wudang Series cross-domain SoCs.

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