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Okins Electronics Co (XKRX:080580) Current Deferred Taxes Liabilities : ₩0 Mil (As of Mar. 2024)


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What is Okins Electronics Co Current Deferred Taxes Liabilities?

Current Deferred Taxes Liabilities represent future tax liabilities, resulting from temporary differences between book (accounting) value of assets and liabilities and their tax value, or timing differences between the recognition of gains and losses in financial statements and their recognition in a tax computation. Deferred tax liabilities generally arise where tax relief is provided in advance of an accounting expense, or income is accrued but not taxed until received.

Okins Electronics Co's current deferred tax liabilities for the quarter that ended in Mar. 2024 was ₩0 Mil.

Okins Electronics Co Current Deferred Taxes Liabilities Historical Data

The historical data trend for Okins Electronics Co's Current Deferred Taxes Liabilities can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Okins Electronics Co Current Deferred Taxes Liabilities Chart

Okins Electronics Co Annual Data
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Current Deferred Taxes Liabilities
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Okins Electronics Co Quarterly Data
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Okins Electronics Co Current Deferred Taxes Liabilities Related Terms

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Okins Electronics Co (XKRX:080580) Business Description

Traded in Other Exchanges
N/A
Address
13, Ojeongongeop-gil, 5th Floor, Gyeonggi-do, Uiwang-si, KOR, 16072
Okins Electronics Co Ltd is a supplier of the device interface system. The company manufactures BiTS products for the applications to support device contacts for both memory and logic products. The business units of the organization include BiTS BU, Semiconductor BU and MEMS BU. The product line of the BiTS BU includes burn-in socket, test socket, memory module test socket, SSD module socket, spring probes and PION. Its semiconductor test service offers IC testing services for fabless design houses on test development and volume operation of wafer probing and package testing. The MEMS division is a solution-oriented department for manufacturing sockets for testing fine pitch packages.

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