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Okins Electronics Co (XKRX:080580) Stock Based Compensation : ₩0 Mil (TTM As of Mar. 2024)


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What is Okins Electronics Co Stock Based Compensation?

Okins Electronics Co's Stock Based Compensation for the three months ended in Mar. 2024 was ₩0 Mil. Its Stock Based Compensation for the trailing twelve months (TTM) ended in Mar. 2024 was ₩0 Mil.


Okins Electronics Co Stock Based Compensation Historical Data

The historical data trend for Okins Electronics Co's Stock Based Compensation can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Okins Electronics Co Stock Based Compensation Chart

Okins Electronics Co Annual Data
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Okins Electronics Co Quarterly Data
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Okins Electronics Co Stock Based Compensation Calculation

Stock Based Compensation is a way corporations use stock options to reward employees. It provides executives and employees the opportunity to share in the growth of the company and, if structured properly, can align their interests with the interests of the company's shareholders and investors, without burning the company's cash on hand.

Stock Based Compensation for the trailing twelve months (TTM) ended in Mar. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was ₩0 Mil.


Okins Electronics Co Stock Based Compensation Related Terms

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Okins Electronics Co (XKRX:080580) Business Description

Traded in Other Exchanges
N/A
Address
13, Ojeongongeop-gil, 5th Floor, Gyeonggi-do, Uiwang-si, KOR, 16072
Okins Electronics Co Ltd is a supplier of the device interface system. The company manufactures BiTS products for the applications to support device contacts for both memory and logic products. The business units of the organization include BiTS BU, Semiconductor BU and MEMS BU. The product line of the BiTS BU includes burn-in socket, test socket, memory module test socket, SSD module socket, spring probes and PION. Its semiconductor test service offers IC testing services for fabless design houses on test development and volume operation of wafer probing and package testing. The MEMS division is a solution-oriented department for manufacturing sockets for testing fine pitch packages.

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