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Okins Electronics Co (XKRX:080580) LT-Debt-to-Total-Asset : 0.24 (As of Mar. 2024)


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What is Okins Electronics Co LT-Debt-to-Total-Asset?

LT Debt to Total Assets is a measurement representing the percentage of a corporation's assets that are financed with loans and financial obligations lasting more than one year. The ratio provides a general measure of the financial position of a company, including its ability to meet financial requirements for outstanding loans. It is calculated as a company's Long-Term Debt & Capital Lease Obligationdivide by its Total Assets. Okins Electronics Co's long-term debt to total assests ratio for the quarter that ended in Mar. 2024 was 0.24.

Okins Electronics Co's long-term debt to total assets ratio increased from Mar. 2023 (0.16) to Mar. 2024 (0.24). It may suggest that Okins Electronics Co is progressively becoming more dependent on debt to grow their business.


Okins Electronics Co LT-Debt-to-Total-Asset Historical Data

The historical data trend for Okins Electronics Co's LT-Debt-to-Total-Asset can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Okins Electronics Co LT-Debt-to-Total-Asset Chart

Okins Electronics Co Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
LT-Debt-to-Total-Asset
Get a 7-Day Free Trial Premium Member Only Premium Member Only 0.11 0.11 0.21 0.11 0.25

Okins Electronics Co Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
LT-Debt-to-Total-Asset Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 0.16 0.16 0.28 0.25 0.24

Okins Electronics Co LT-Debt-to-Total-Asset Calculation

Okins Electronics Co's Long-Term Debt to Total Asset Ratio for the fiscal year that ended in Dec. 2023 is calculated as

LT Debt to Total Assets (A: Dec. 2023 )=Long-Term Debt & Capital Lease Obligation (A: Dec. 2023 )/Total Assets (A: Dec. 2023 )
=22524.782/91497.98
=0.25

Okins Electronics Co's Long-Term Debt to Total Asset Ratio for the quarter that ended in Mar. 2024 is calculated as

LT Debt to Total Assets (Q: Mar. 2024 )=Long-Term Debt & Capital Lease Obligation (Q: Mar. 2024 )/Total Assets (Q: Mar. 2024 )
=23163.862/94764.986
=0.24

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Okins Electronics Co  (XKRX:080580) LT-Debt-to-Total-Asset Explanation

LT Debt to Total Asset is a measurement representing the percentage of a corporation's assets that are financed with loans and financial obligations lasting more than one year. The ratio provides a general measure of the financial position of a company, including its ability to meet financial requirements for outstanding loans. A year-over-year decrease in this metric would suggest the company is progressively becoming less dependent on debt to grow their business.


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Okins Electronics Co (XKRX:080580) Business Description

Traded in Other Exchanges
N/A
Address
13, Ojeongongeop-gil, 5th Floor, Gyeonggi-do, Uiwang-si, KOR, 16072
Okins Electronics Co Ltd is a supplier of the device interface system. The company manufactures BiTS products for the applications to support device contacts for both memory and logic products. The business units of the organization include BiTS BU, Semiconductor BU and MEMS BU. The product line of the BiTS BU includes burn-in socket, test socket, memory module test socket, SSD module socket, spring probes and PION. Its semiconductor test service offers IC testing services for fabless design houses on test development and volume operation of wafer probing and package testing. The MEMS division is a solution-oriented department for manufacturing sockets for testing fine pitch packages.

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