Okins Electronics Co (XKRX:080580) Interest Expense : ₩-3,073 Mil (TTM As of Mar. 2024)

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What is Okins Electronics Co Interest Expense?

Interest Expense is the amount reported by a company or individual as an expense for borrowed money. Okins Electronics Co's interest expense for the three months ended in Mar. 2024 was ₩ -856 Mil. Its interest expense for the trailing twelve months (TTM) ended in Mar. 2024 was ₩-3,073 Mil.

Interest Coverage is a ratio that determines how easily a company can pay interest expenses on outstanding debt. It is calculated by dividing a company's Operating Income(EBIT) by its Interest Expense. Okins Electronics Co's Operating Income for the three months ended in Mar. 2024 was ₩ 212 Mil. Okins Electronics Co's Interest Expense for the three months ended in Mar. 2024 was ₩ -856 Mil. Okins Electronics Co's Interest Coverage for the quarter that ended in Mar. 2024 was 0.25. The higher the ratio, the stronger the company's financial strength is. Note: If both Interest Expense and Interest Income are empty, while Net Interest Income is negative, then use Net Interest Income as Interest Expense.

Okins Electronics Co Interest Expense Historical Data

The historical data trend for Okins Electronics Co's Interest Expense can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Okins Electronics Co Interest Expense Chart

Okins Electronics Co Annual Data

Trend

Dec14

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Dec23

Interest Expense

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-1,117.41

-874.97

-1,245.50

-2,133.98

-2,911.30

Okins Electronics Co Quarterly Data
	Jun19	Sep19	Dec19	Mar20	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24
Interest Expense	Get a 7-Day Free Trial															-694.28	-716.16	-546.20	-954.67	-855.87

Okins Electronics Co Interest Expense Calculation

Interest Expense is the amount reported by a company or individual as an expense for borrowed money.

Interest Expense for the trailing twelve months (TTM) ended in Mar. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was ₩-3,073 Mil.

Okins Electronics Co (XKRX:080580) Interest Expense Explanation

Note: If both Interest Expense and Interest Income are empty, while Net Interest Income is negative, then use Net Interest Income as Interest Expense.

Okins Electronics Co's Interest Expense for the three months ended in Mar. 2024 was ₩-856 Mil. Its Operating Income for the three months ended in Mar. 2024 was ₩212 Mil. And its Long-Term Debt & Capital Lease Obligation for the three months ended in Mar. 2024 was ₩23,164 Mil.

Okins Electronics Co's Interest Coverage for the quarter that ended in Mar. 2024 is calculated as

Interest Coverage	=	-1	*	Operating Income (Q: Mar. 2024 )	/	Interest Expense (Q: Mar. 2024 )
	=	-1	*	211.938	/	-855.865
	=	0.25

The higher the ratio, the stronger the company's financial strength is.

Warning Sign:

Ben Graham prefers companies' interest coverage to be at least 5. Okins Electronics Co Ltds earnings cannot cover its interest expense. If the situation continues, the company may have to issue more debt.

Okins Electronics Co (XKRX:080580) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Okins Electronics Co Ltd (XKRX:080580) » Definitions » Interest Expense

Traded in Other Exchanges

N/A

Address

13, Ojeongongeop-gil, 5th Floor, Gyeonggi-do, Uiwang-si, KOR, 16072

Website

http://www.okins.co.kr

Okins Electronics Co Ltd is a supplier of the device interface system. The company manufactures BiTS products for the applications to support device contacts for both memory and logic products. The business units of the organization include BiTS BU, Semiconductor BU and MEMS BU. The product line of the BiTS BU includes burn-in socket, test socket, memory module test socket, SSD module socket, spring probes and PION. Its semiconductor test service offers IC testing services for fabless design houses on test development and volume operation of wafer probing and package testing. The MEMS division is a solution-oriented department for manufacturing sockets for testing fine pitch packages.

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