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Okins Electronics Co (XKRX:080580) Total Liabilities : ₩58,308 Mil (As of Mar. 2024)


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What is Okins Electronics Co Total Liabilities?

Okins Electronics Co's Total Liabilities for the quarter that ended in Mar. 2024 was ₩58,308 Mil.

Okins Electronics Co's quarterly Total Liabilities declined from Sep. 2023 (₩60,080.89 Mil) to Dec. 2023 (₩55,536.54 Mil) but then increased from Dec. 2023 (₩55,536.54 Mil) to Mar. 2024 (₩58,308.21 Mil).

Okins Electronics Co's annual Total Liabilities increased from Dec. 2021 (₩41,716.09 Mil) to Dec. 2022 (₩49,585.91 Mil) and increased from Dec. 2022 (₩49,585.91 Mil) to Dec. 2023 (₩55,536.54 Mil).


Okins Electronics Co Total Liabilities Historical Data

The historical data trend for Okins Electronics Co's Total Liabilities can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Okins Electronics Co Total Liabilities Chart

Okins Electronics Co Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Total Liabilities
Get a 7-Day Free Trial Premium Member Only Premium Member Only 28,863.57 27,483.08 41,716.09 49,585.91 55,536.54

Okins Electronics Co Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
Total Liabilities Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 53,607.33 53,065.15 60,080.89 55,536.54 58,308.21

Okins Electronics Co Total Liabilities Calculation

Total Liabilities are the liabilities that the company has to pay others. It is a part of the balance sheet of a company that shareholders do not own, and would be obligated to pay back if the company liquidated.

Okins Electronics Co's Total Liabilities for the fiscal year that ended in Dec. 2023 is calculated as

Total Liabilities=Total Current Liabilities+Total Noncurrent Liabilities
=Total Current Liabilities+(Long-Term Debt & Capital Lease Obligation+Other Long-Term Liabilities
=29453.421+(22524.782+239.092
+NonCurrent Deferred Liabilities+PensionAndRetirementBenefit)
+0+3319.249)
=55,537

Total Liabilities=Total Assets (A: Dec. 2023 )-Total Equity (A: Dec. 2023 )
=91497.98-35961.436
=55,537

Okins Electronics Co's Total Liabilities for the quarter that ended in Mar. 2024 is calculated as

Total Liabilities=Total Current Liabilities+Total Noncurrent Liabilities
=Total Current Liabilities+(Long-Term Debt & Capital Lease Obligation+Other Long-Term Liabilities
=31435.011+(23163.862+238.845
+NonCurrent Deferred Liabilities+PensionAndRetirementBenefit)
+0+3470.493)
=58,308

Total Liabilities=Total Assets (Q: Mar. 2024 )-Total Equity (Q: Mar. 2024 )
=94764.986-36456.775
=58,308

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


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Okins Electronics Co (XKRX:080580) Business Description

Traded in Other Exchanges
N/A
Address
13, Ojeongongeop-gil, 5th Floor, Gyeonggi-do, Uiwang-si, KOR, 16072
Okins Electronics Co Ltd is a supplier of the device interface system. The company manufactures BiTS products for the applications to support device contacts for both memory and logic products. The business units of the organization include BiTS BU, Semiconductor BU and MEMS BU. The product line of the BiTS BU includes burn-in socket, test socket, memory module test socket, SSD module socket, spring probes and PION. Its semiconductor test service offers IC testing services for fabless design houses on test development and volume operation of wafer probing and package testing. The MEMS division is a solution-oriented department for manufacturing sockets for testing fine pitch packages.

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