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Okins Electronics Co (XKRX:080580) Intangible Assets : ₩3,064 Mil (As of Mar. 2024)


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What is Okins Electronics Co Intangible Assets?

Intangible assets are defined as identifiable non-monetary assets that cannot be seen, touched or physically measured. Okins Electronics Co's intangible assets for the quarter that ended in Mar. 2024 was ₩3,064 Mil.


Okins Electronics Co Intangible Assets Historical Data

The historical data trend for Okins Electronics Co's Intangible Assets can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Okins Electronics Co Intangible Assets Chart

Okins Electronics Co Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Intangible Assets
Get a 7-Day Free Trial Premium Member Only Premium Member Only 4,026.53 3,929.25 3,744.33 3,280.79 3,095.06

Okins Electronics Co Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
Intangible Assets Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 3,091.14 2,903.03 2,755.52 3,095.06 3,064.03

Okins Electronics Co Intangible Assets Calculation

Intangible assets are defined as identifiable non-monetary assets that cannot be seen, touched or physically measured. Examples of intangible assets include trade secrets, copyrights, patents, trademarks. If a company acquires assets at the prices above the book value, it may carry goodwill on its balance sheet. Goodwill reflects the difference between the price the company paid and the book value of the assets.


Okins Electronics Co  (XKRX:080580) Intangible Assets Explanation

If a company (company A) received a patent through their own work, though it has value, it does not show up on its balance sheet as an intangible asset. However, if company A sells this patent to company B, it will show up on company B's balance sheet as an intangible asset.

The same applies to brand names, trade secrets etc. For instance, Coca-Cola's brand is extremely valuable, but the brand does not appear on its balance sheet, because the brand was never acquired.

Some intangibles are amortized. Amortization is the depreciation of intangible assets.

Many intangibles are not amortized. They may still be written down when the company decides the asset is impaired.

Whenever you see an increase in goodwill over a number of years, you can assume it's because the company is out buying other businesses above book value. GOOD if buying businesses with durable competitive advantage.

If goodwill stays the same, the company when acquiring other companies is either paying less than book value or not acquiring. Businesses with moats never sell for less than book value.

Intangibles acquired are on balance sheet at fair value.

Internally developed brand names (Coke, Wrigleys, Band-Aid) however are not reflected on the balance sheet.

One of the reasons competitive advantage power can remain hidden for so long.


Be Aware

Companies may change the way intangible assets are amortized, and this will affect their reported earnings.


Okins Electronics Co Intangible Assets Related Terms

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Okins Electronics Co (XKRX:080580) Business Description

Traded in Other Exchanges
N/A
Address
13, Ojeongongeop-gil, 5th Floor, Gyeonggi-do, Uiwang-si, KOR, 16072
Okins Electronics Co Ltd is a supplier of the device interface system. The company manufactures BiTS products for the applications to support device contacts for both memory and logic products. The business units of the organization include BiTS BU, Semiconductor BU and MEMS BU. The product line of the BiTS BU includes burn-in socket, test socket, memory module test socket, SSD module socket, spring probes and PION. Its semiconductor test service offers IC testing services for fabless design houses on test development and volume operation of wafer probing and package testing. The MEMS division is a solution-oriented department for manufacturing sockets for testing fine pitch packages.

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