Win Semiconductors (ROCO:3105) Debt-to-Asset : 0.34 (As of Sep. 2024)

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What is Win Semiconductors Debt-to-Asset?

Win Semiconductors's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Sep. 2024 was NT$4,693 Mil. Win Semiconductors's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Sep. 2024 was NT$16,939 Mil. Win Semiconductors's Long-Term Debt & Capital Lease ObligationTotal Assets for the quarter that ended in Sep. 2024 was NT$64,209 Mil. Win Semiconductors's debt to asset for the quarter that ended in Sep. 2024 was 0.34.

Win Semiconductors Debt-to-Asset Historical Data

The historical data trend for Win Semiconductors's Debt-to-Asset can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Win Semiconductors Debt-to-Asset Chart

Win Semiconductors Annual Data

Trend

Dec14

Dec15

Dec16

Dec17

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

Debt-to-Asset

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0.15

0.22

0.41

0.42

Win Semiconductors Quarterly Data
	Dec19	Mar20	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24	Jun24	Sep24
Debt-to-Asset	Get a 7-Day Free Trial															0.40	0.42	0.36	0.35	0.34

Competitive Comparison of Win Semiconductors's Debt-to-Asset

For the Semiconductors subindustry, Win Semiconductors's Debt-to-Asset, along with its competitors' market caps and Debt-to-Asset data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.

Win Semiconductors's Debt-to-Asset Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, Win Semiconductors's Debt-to-Asset distribution charts can be found below:

* The bar in red indicates where Win Semiconductors's Debt-to-Asset falls into.

Win Semiconductors Debt-to-Asset Calculation

Debt to Asset measures the financial leverage a company has.

Win Semiconductors's Debt-to-Asset for the fiscal year that ended in Dec. 2023 is calculated as

Debt-to-Asset	=	Total Debt			/	Total Assets
	=	(Short-Term Debt & Capital Lease Obligation	+	Long-Term Debt & Capital Lease Obligation)	/	Total Assets
	=	(7864.796	+	20884.544)	/	69168.035
	=	0.42

Win Semiconductors's Debt-to-Asset for the quarter that ended in Sep. 2024 is calculated as

Debt-to-Asset	=	Total Debt			/	Total Assets
	=	(Short-Term Debt & Capital Lease Obligation	+	Long-Term Debt & Capital Lease Obligation)	/	Total Assets
	=	(4692.727	+	16939.448)	/	64209.406
	=	0.34

Win Semiconductors (ROCO:3105) Debt-to-Asset Explanation

In the calculation of Debt-to-Asset, we use the total of Short-Term Debt & Capital Lease Obligation and Long-Term Debt & Capital Lease Obligation divided by Total Assets.

Win Semiconductors Debt-to-Asset Related Terms

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Win Semiconductors Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Win Semiconductors Corp (ROCO:3105) » Definitions » Debt-to-Asset

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Address

No. 69, Keji 7th Road, Hwaya Technology Park, Guishan District, Taoyuan, TWN, 33383

Website

https://www.winfoundry.com

Founded in 1999, Win Semiconductors is the largest foundry for nonsilicon-based semiconductor components, most notably gallium arsenide, or GaAs; gallium nitride, or GaN; and silicon carbide, or SiC. Per Strategy Analytics, Win Semi wielded almost 70% share in the GaAs foundry market in 2023, followed by Advanced Wireless Semiconductor and GCS Holdings. The company's headquarters, four factories and most of its 3,500 employees are based in Taoyuan City, Taiwan. Its products are applied in mobile, Wi-Fi networks, cellular infrastructure (such as base stations), satellite communication, optical communication and 3D sensing. The company also provides automated testing and inspection services.

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