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Inpaq Technology Co (ROCO:6284) Debt-to-Asset : 0.25 (As of Dec. 2024)


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What is Inpaq Technology Co Debt-to-Asset?

Inpaq Technology Co's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Dec. 2024 was NT$1,563 Mil. Inpaq Technology Co's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Dec. 2024 was NT$1,798 Mil. Inpaq Technology Co's Long-Term Debt & Capital Lease ObligationTotal Assets for the quarter that ended in Dec. 2024 was NT$13,552 Mil. Inpaq Technology Co's debt to asset for the quarter that ended in Dec. 2024 was 0.25.


Inpaq Technology Co Debt-to-Asset Historical Data

The historical data trend for Inpaq Technology Co's Debt-to-Asset can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Inpaq Technology Co Debt-to-Asset Chart

Inpaq Technology Co Annual Data
Trend Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23 Dec24
Debt-to-Asset
Get a 7-Day Free Trial Premium Member Only Premium Member Only 0.07 0.18 0.26 0.25 0.25

Inpaq Technology Co Quarterly Data
Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24 Dec24
Debt-to-Asset Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 0.25 0.23 0.24 0.27 0.25

Competitive Comparison of Inpaq Technology Co's Debt-to-Asset

For the Electronic Components subindustry, Inpaq Technology Co's Debt-to-Asset, along with its competitors' market caps and Debt-to-Asset data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Inpaq Technology Co's Debt-to-Asset Distribution in the Hardware Industry

For the Hardware industry and Technology sector, Inpaq Technology Co's Debt-to-Asset distribution charts can be found below:

* The bar in red indicates where Inpaq Technology Co's Debt-to-Asset falls into.


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Inpaq Technology Co Debt-to-Asset Calculation

Debt to Asset measures the financial leverage a company has.

Inpaq Technology Co's Debt-to-Asset for the fiscal year that ended in Dec. 2024 is calculated as

Debt-to-Asset=Total Debt / Total Assets
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Total Assets
=(1563.142 + 1797.932) / 13551.746
=0.25

Inpaq Technology Co's Debt-to-Asset for the quarter that ended in Dec. 2024 is calculated as

Debt-to-Asset=Total Debt / Total Assets
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Total Assets
=(1563.142 + 1797.932) / 13551.746
=0.25

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Inpaq Technology Co  (ROCO:6284) Debt-to-Asset Explanation

In the calculation of Debt-to-Asset, we use the total of Short-Term Debt & Capital Lease Obligation and Long-Term Debt & Capital Lease Obligation divided by Total Assets.


Inpaq Technology Co Debt-to-Asset Related Terms

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Inpaq Technology Co Business Description

Traded in Other Exchanges
N/A
Address
No.11, KeYi Street, Zhunan Town, Miaoli, TWN, 350402
Inpaq Technology Co Ltd is a Taiwan-based company that engages in research, development, manufacturing, and sales of integrated protection components, microwave composite miniature antennas and modules, and multilayer microwave communication components and their modules. The company group has two reportable segments: the high-frequency component segment and the passive component segment. The company generates the majority of the revenue generated by the high-frequency component segment from China. The high-frequency component segment of the company produces various communication device components mainly used in mobile phones, (GPS), wireless communication networks, and Bluetooth modules.

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