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Hanwool Semiconductor (XKRX:320000) Total Liabilities : ₩13,894 Mil (As of Dec. 2024)


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What is Hanwool Semiconductor Total Liabilities?

Hanwool Semiconductor's Total Liabilities for the quarter that ended in Dec. 2024 was ₩13,894 Mil.

Hanwool Semiconductor's quarterly Total Liabilities increased from Jun. 2024 (₩11,945.50 Mil) to Sep. 2024 (₩15,123.61 Mil) but then declined from Sep. 2024 (₩15,123.61 Mil) to Dec. 2024 (₩13,893.94 Mil).

Hanwool Semiconductor's annual Total Liabilities increased from Dec. 2022 (₩6,013.23 Mil) to Dec. 2023 (₩14,604.94 Mil) but then declined from Dec. 2023 (₩14,604.94 Mil) to Dec. 2024 (₩13,893.94 Mil).


Hanwool Semiconductor Total Liabilities Historical Data

The historical data trend for Hanwool Semiconductor's Total Liabilities can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Hanwool Semiconductor Total Liabilities Chart

Hanwool Semiconductor Annual Data
Trend Dec19 Dec20 Dec21 Dec22 Dec23 Dec24
Total Liabilities
Get a 7-Day Free Trial 1,955.69 3,510.68 6,013.23 14,604.94 13,893.94

Hanwool Semiconductor Quarterly Data
Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24 Dec24
Total Liabilities Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 14,604.94 14,626.48 11,945.50 15,123.61 13,893.94

Hanwool Semiconductor Total Liabilities Calculation

Total Liabilities are the liabilities that the company has to pay others. It is a part of the balance sheet of a company that shareholders do not own, and would be obligated to pay back if the company liquidated.

Hanwool Semiconductor's Total Liabilities for the fiscal year that ended in Dec. 2024 is calculated as

Total Liabilities=Total Current Liabilities+Total Noncurrent Liabilities
=Total Current Liabilities+(Long-Term Debt & Capital Lease Obligation+Other Long-Term Liabilities
=6471.468+(7422.466+0.00099999999929423
+NonCurrent Deferred Liabilities+PensionAndRetirementBenefit+NonCurrent Deferred Income Tax)
+0+0+0)
=13,894

Total Liabilities=Total Assets (A: Dec. 2024 )-Total Equity (A: Dec. 2024 )
=51423.661-37529.727
=13,894

Hanwool Semiconductor's Total Liabilities for the quarter that ended in Dec. 2024 is calculated as

Total Liabilities=Total Current Liabilities+Total Noncurrent Liabilities
=Total Current Liabilities+(Long-Term Debt & Capital Lease Obligation+Other Long-Term Liabilities
=6471.468+(7422.466+0.00099999999929423
+NonCurrent Deferred Liabilities+PensionAndRetirementBenefit+NonCurrent Deferred Income Tax)
+0+0+0)
=13,894

Total Liabilities=Total Assets (Q: Dec. 2024 )-Total Equity (Q: Dec. 2024 )
=51423.661-37529.727
=13,894

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Hanwool Semiconductor Total Liabilities Related Terms

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Hanwool Semiconductor Business Description

Traded in Other Exchanges
N/A
Address
166 Gosan-ro, Gunpo-si, Gyeonggi-do, SK Ventium 104 Building 1001, Seoul, KOR, 15850
Hanwool Semiconductor Inc formerly Wintec Co Ltd is a technology company developing and producing advanced intelligent inspection equipment in the fields related to OLED, microchip, high-functional film, and X-ray by combining artificial intelligence analysis function based on image processing technology and advanced electrical measurement technology. The company's products inspect the external condition of Micro Chip at high speed; inspects the state of reel tape at high speed; measures the characteristics of Micro Chip (C/DF, IR, BDV); inspects the external condition of the film at high speed.

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