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WINPAC (XKRX:097800) Current Accrued Expense : ₩0 Mil (As of Sep. 2024)


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What is WINPAC Current Accrued Expense?

WINPAC's Current Accrued Expense for the quarter that ended in Sep. 2024 was ₩0 Mil.

WINPAC Current Accrued Expense Historical Data

The historical data trend for WINPAC's Current Accrued Expense can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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WINPAC Current Accrued Expense Chart

WINPAC Annual Data
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Current Accrued Expense
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WINPAC Quarterly Data
Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24
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WINPAC Current Accrued Expense Calculation

Current Accrued Expense is the expense incurred during the accounting period, but not required to be paid until a later date. It includes compensation, interest, pensions and all other miscellaneous accruals reported by the company.

WINPAC Current Accrued Expense Related Terms

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WINPAC Business Description

Industry
GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » WINPAC Inc (XKRX:097800) » Definitions » Current Accrued Expense
Comparable Companies
XKRX:093520 XKRX:172670 XKRX:217190 XKRX:219420 XKRX:017900 XKRX:099220 XKRX:072990 XKRX:080000 XKRX:142210 XKRX:089850 NVDA AVGO TPE:2330 AMD QCOM TXN ADI MU MRVL INTC
Traded in Other Exchanges
N/A
Address
351-25 Gachang-Ri, Baegam-Myeon, Cheoin-gu, Yongin, Gyeonggi-do, KOR, 449862
Website
http://winpac.co.kr
WINPAC Inc manufactures semiconductor and related solid-state devices. It offers outsourcing production services for semiconductor packaging and testing. The Company's package products include fine pitch ball grid array (FBAG), land grid array (LGA), package on package (POP) and flip chip. It also provides water level package solutions for image sensor/memory/logic applications.

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