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WINPAC (XKRX:097800) Debt-to-Revenue : 1.03 (As of Sep. 2024)


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What is WINPAC Debt-to-Revenue?

Debt-to-Revenue measures a company's ability to pay off its debt.

WINPAC's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Sep. 2024 was ₩57,408 Mil. WINPAC's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Sep. 2024 was ₩10,108 Mil. WINPAC's annualized Revenue for the quarter that ended in Sep. 2024 was ₩65,321 Mil. WINPAC's annualized Debt-to-Revenue for the quarter that ended in Sep. 2024 was 1.03.


WINPAC Debt-to-Revenue Historical Data

The historical data trend for WINPAC's Debt-to-Revenue can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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WINPAC Debt-to-Revenue Chart

WINPAC Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Debt-to-Revenue
Get a 7-Day Free Trial Premium Member Only Premium Member Only 0.52 0.60 0.60 0.46 0.98

WINPAC Quarterly Data
Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24
Debt-to-Revenue Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 1.25 1.11 1.01 0.88 1.03

Competitive Comparison of WINPAC's Debt-to-Revenue

For the Semiconductors subindustry, WINPAC's Debt-to-Revenue, along with its competitors' market caps and Debt-to-Revenue data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


WINPAC's Debt-to-Revenue Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, WINPAC's Debt-to-Revenue distribution charts can be found below:

* The bar in red indicates where WINPAC's Debt-to-Revenue falls into.



WINPAC Debt-to-Revenue Calculation

Debt-to-Revenue measures a company's ability to pay off its debt.

WINPAC's Debt-to-Revenue for the fiscal year that ended in Dec. 2023 is calculated as

Debt-to-Revenue=Total Debt / Revenue
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Revenue
=(52884.475 + 31923.74) / 86205.142
=0.98

WINPAC's annualized Debt-to-Revenue for the quarter that ended in Sep. 2024 is calculated as

Debt-to-Revenue=Total Debt / Revenue
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Revenue
=(57407.985 + 10107.984) / 65320.936
=1.03

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

In the calculation of annual Debt-to-Revenue, the Revenue of the last fiscal year is used. In calculating the annualized quarterly data, the Revenue data used here is four times the quarterly (Sep. 2024) Revenue data.


WINPAC Debt-to-Revenue Related Terms

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WINPAC Business Description

Traded in Other Exchanges
N/A
Address
351-25 Gachang-Ri, Baegam-Myeon, Cheoin-gu, Yongin, Gyeonggi-do, KOR, 449862
WINPAC Inc manufactures semiconductor and related solid-state devices. It offers outsourcing production services for semiconductor packaging and testing. The Company's package products include fine pitch ball grid array (FBAG), land grid array (LGA), package on package (POP) and flip chip. It also provides water level package solutions for image sensor/memory/logic applications.

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