WINPAC (XKRX:097800) Short-Term Debt : ₩59,553 Mil (As of Dec. 2024)

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What is WINPAC Short-Term Debt?

WINPAC's Short-Term Debt for the quarter that ended in Dec. 2024 was ₩59,553 Mil.

WINPAC's quarterly Short-Term Debt declined from Jun. 2024 (₩58,952 Mil) to Sep. 2024 (₩57,030 Mil) but then increased from Sep. 2024 (₩57,030 Mil) to Dec. 2024 (₩59,553 Mil).

WINPAC's annual Short-Term Debt increased from Dec. 2022 (₩40,435 Mil) to Dec. 2023 (₩50,817 Mil) and increased from Dec. 2023 (₩50,817 Mil) to Dec. 2024 (₩59,553 Mil).

WINPAC Short-Term Debt Historical Data

The historical data trend for WINPAC's Short-Term Debt can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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WINPAC Short-Term Debt Chart

WINPAC Annual Data

Trend

Dec15

Dec16

Dec17

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

Dec24

Short-Term Debt

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36,047.30

50,123.74

40,435.30

50,816.56

59,553.42

WINPAC Quarterly Data
	Mar20	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24	Jun24	Sep24	Dec24
Short-Term Debt	Get a 7-Day Free Trial															50,816.56	55,347.24	58,952.15	57,029.84	59,553.42

WINPAC Short-Term Debt Explanation

Short-Term Debt represents the total amount of Long-Term Debt such as bank loans and commercial paper, which is due within one year.

WINPAC Short-Term Debt Related Terms

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WINPAC Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » WINPAC Inc (XKRX:097800) » Definitions » Short-Term Debt

Comparable Companies

Traded in Other Exchanges

N/A

Address

351-25 Gachang-Ri, Baegam-Myeon, Cheoin-gu, Yongin, Gyeonggi-do, KOR, 449862

Website

http://winpac.co.kr

WINPAC Inc manufactures semiconductor and related solid-state devices. It offers outsourcing production services for semiconductor packaging and testing. The Company's package products include fine pitch ball grid array (FBAG), land grid array (LGA), package on package (POP) and flip chip. It also provides water level package solutions for image sensor/memory/logic applications.

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