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WINPAC (XKRX:097800) FCF Margin % : -31.02% (As of Sep. 2024)


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What is WINPAC FCF Margin %?

FCF Margin % is calculated as Free Cash Flow divided by its Revenue. WINPAC's Free Cash Flow for the three months ended in Sep. 2024 was ₩-5,065 Mil. WINPAC's Revenue for the three months ended in Sep. 2024 was ₩16,330 Mil. Therefore, WINPAC's FCF Margin % for the quarter that ended in Sep. 2024 was -31.02%.

As of today, WINPAC's current FCF Yield % is -18.86%.

The historical rank and industry rank for WINPAC's FCF Margin % or its related term are showing as below:

XKRX:097800' s FCF Margin % Range Over the Past 10 Years
Min: -22.85   Med: -12.77   Max: 0.99
Current: -19.35


During the past 12 years, the highest FCF Margin % of WINPAC was 0.99%. The lowest was -22.85%. And the median was -12.77%.

XKRX:097800's FCF Margin % is ranked worse than
74.65% of 1002 companies
in the Semiconductors industry
Industry Median: -1.485 vs XKRX:097800: -19.35


WINPAC FCF Margin % Historical Data

The historical data trend for WINPAC's FCF Margin % can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

WINPAC FCF Margin % Chart

WINPAC Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
FCF Margin %
Get a 7-Day Free Trial Premium Member Only Premium Member Only -19.97 -7.38 -20.27 -15.88 -22.85

WINPAC Quarterly Data
Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24
FCF Margin % Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only -43.22 3.02 -21.58 -28.41 -31.02

Competitive Comparison of WINPAC's FCF Margin %

For the Semiconductors subindustry, WINPAC's FCF Margin %, along with its competitors' market caps and FCF Margin % data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


WINPAC's FCF Margin % Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, WINPAC's FCF Margin % distribution charts can be found below:

* The bar in red indicates where WINPAC's FCF Margin % falls into.



WINPAC FCF Margin % Calculation

FCF margin is the ratio of Free Cash Flow divided by net sales or Revenue, usually presented in percent.

WINPAC's FCF Margin for the fiscal year that ended in Dec. 2023 is calculated as

FCF Margin=Free Cash Flow (A: Dec. 2023 )/Revenue (A: Dec. 2023 )
=-19698.29/86205.142
=-22.85 %

WINPAC's FCF Margin for the quarter that ended in Sep. 2024 is calculated as

FCF Margin=Free Cash Flow (Q: Sep. 2024 )/Revenue (Q: Sep. 2024 )
=-5065.04/16330.234
=-31.02 %

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


WINPAC FCF Margin % Related Terms

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WINPAC Business Description

Traded in Other Exchanges
N/A
Address
351-25 Gachang-Ri, Baegam-Myeon, Cheoin-gu, Yongin, Gyeonggi-do, KOR, 449862
WINPAC Inc manufactures semiconductor and related solid-state devices. It offers outsourcing production services for semiconductor packaging and testing. The Company's package products include fine pitch ball grid array (FBAG), land grid array (LGA), package on package (POP) and flip chip. It also provides water level package solutions for image sensor/memory/logic applications.

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