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HB Technology Co (XKRX:078150) Float Percentage Of Total Shares Outstanding : 0.00% (As of May. 24, 2025)


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What is HB Technology Co Float Percentage Of Total Shares Outstanding?

Float percentage of total shares outstanding is the percentage of float shares relative to the total shares outstanding. As of today, HB Technology Co's float shares is 0.00 Mil. HB Technology Co's total shares outstanding is 88.85 Mil. HB Technology Co's float percentage of total shares outstanding is 0.00%.

Insider Ownership is the percentage of shares that are owned by company insiders relative to the total shares outstanding. As of today, HB Technology Co's Insider Ownership is 0.00%.

Institutional Ownership is the percentage of shares that are owned by institutions out of the total shares outstanding. As of today, HB Technology Co's Institutional Ownership is 0.87%.

HB Technology Co Float Percentage Of Total Shares Outstanding Calculation

It is the percentage of float shares out of the total shares outstanding.

HB Technology Co's Float Percentage of Total Shares Outstanding for today is calculated as follows:

Float Percentage of Total Shares Outstanding=Float Shares/Total Shares Outstanding
=0.00/88.85
=0.00%

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

HB Technology Co Business Description

Industry
GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » HB Technology Co Ltd (XKRX:078150) » Definitions » Float Percentage Of Total Shares Outstanding
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Traded in Other Exchanges
N/A
Address
87, Sandong-ro, Eumbong-myeon, Asan-si, Chungcheongnamdo, KOR, 31419
Website
http://www.hbtechnology.co.kr
HB Technology Co Ltd is a Korea-based semiconductor and display equipment manufacturer. It has also expanded its business area to semiconductor wafer 2D/3D inspection equipment, laser processing equipment, and display component materials. The company organizes its business operations into two divisions: Equipment Division and Components Division. Equipment Division comprises display, semiconductor and laser dicing. Components Division includes diffusion plate and light guide plate.

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