HB Technology Co (XKRX:078150) Change In Receivables : ₩3,150 Mil (TTM As of Dec. 2024)

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What is HB Technology Co Change In Receivables?

HB Technology Co's change in receivables for the quarter that ended in Dec. 2024 was ₩10,737 Mil. It means HB Technology Co's Accounts Receivable declined by ₩10,737 Mil from Sep. 2024 to Dec. 2024 .

HB Technology Co's change in receivables for the fiscal year that ended in Dec. 2024 was ₩3,150 Mil. It means HB Technology Co's Accounts Receivable declined by ₩3,150 Mil from Dec. 2023 to Dec. 2024 .

HB Technology Co's Accounts Receivable for the quarter that ended in Dec. 2024 was ₩18,403 Mil.

Days Sales Outstanding measures of the average number of days that a company takes to collect revenue after a sale has been made. It is a financial ratio that illustrates how well a company's Accounts Receivable are being managed. HB Technology Co's Days Sales Outstanding for the three months ended in Dec. 2024 was 57.83.

In Ben Graham's calculation of liquidation value, Apple Inc's Accounts Receivable are only considered to be worth 75% of book value. HB Technology Co's liquidation value for the three months ended in Dec. 2024 was ₩-34,756 Mil.

HB Technology Co Change In Receivables Historical Data

The historical data trend for HB Technology Co's Change In Receivables can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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HB Technology Co Change In Receivables Chart

HB Technology Co Annual Data

Trend

Dec15

Dec16

Dec17

Dec18

Dec19

Dec20

Dec21

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Dec23

Dec24

Change In Receivables

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21,581.83

-2,111.91

-227.65

3,578.00

3,149.97

HB Technology Co Quarterly Data
	Mar20	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24	Jun24	Sep24	Dec24
Change In Receivables	Get a 7-Day Free Trial															16,335.98	-3,009.90	-8,673.20	4,096.01	10,737.07

HB Technology Co Change In Receivables Calculation

Change In Accounts Receivable relative to the previous period. It is any increase or decrease in the cash a company is owed by its customers.

Change In Receivables for the trailing twelve months (TTM) ended in Dec. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was ₩3,150 Mil.

HB Technology Co (XKRX:078150) Change In Receivables Explanation

1. Accounts Receivable are created when a customer has received a product but has not yet paid for that product. Days Sales Outstanding measures of the average number of days that a company takes to collect revenue after a sale has been made. It is a financial ratio that illustrates how well a company's Accounts Receivable are being managed.

HB Technology Co's Days Sales Outstanding for the quarter that ended in Dec. 2024 is calculated as:

	Days Sales Outstanding
=	Accounts Receivable	/	Revenue	*	Days in Period
=	18403.404	/	29036.987	*	91
=	57.83

2. In Ben Graham's calculation of liquidation value, HB Technology Co's accounts receivable are only considered to be worth 75% of book value:

HB Technology Co's liquidation value for the quarter that ended in Dec. 2024 is calculated as:

	Liquidation Value
=	Cash, Cash Equivalents, Marketable Securities	-	Total Liabilities	+	(0.75 * Accounts Receivable)	+	(0.5 * Total Inventories)
=	33432.116	-	92110.793	+	0.75 * 18403.404	+	0.5 * 20239.785
=	-34,756

HB Technology Co Change In Receivables Related Terms

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HB Technology Co Business Description

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GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » HB Technology Co Ltd (XKRX:078150) » Definitions » Change In Receivables

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Address

87, Sandong-ro, Eumbong-myeon, Asan-si, Chungcheongnamdo, KOR, 31419

Website

http://www.hbtechnology.co.kr

HB Technology Co Ltd is a Korea-based semiconductor and display equipment manufacturer. It has also expanded its business area to semiconductor wafer 2D/3D inspection equipment, laser processing equipment, and display component materials. The company organizes its business operations into two divisions: Equipment Division and Components Division. Equipment Division comprises display, semiconductor and laser dicing. Components Division includes diffusion plate and light guide plate.

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