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HB Technology Co (XKRX:078150) Total Current Assets : ₩89,095 Mil (As of Mar. 2025)


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What is HB Technology Co Total Current Assets?

Total current assets includes Cash, Cash Equivalents, Marketable Securities, Total Receivables, Total Inventories, and Other Current Assets. HB Technology Co's total current assets for the quarter that ended in Mar. 2025 was ₩89,095 Mil.


HB Technology Co Total Current Assets Historical Data

The historical data trend for HB Technology Co's Total Current Assets can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

HB Technology Co Total Current Assets Chart

HB Technology Co Annual Data
Trend Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23 Dec24
Total Current Assets
Get a 7-Day Free Trial Premium Member Only Premium Member Only 165,054.85 106,088.53 83,657.86 104,701.87 92,541.33

HB Technology Co Quarterly Data
Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24 Dec24 Mar25
Total Current Assets Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 107,761.69 104,417.41 93,219.15 92,541.33 89,094.98

HB Technology Co Total Current Assets Calculation

Total Current Assets are the asset that can be converted to cash or used to pay current liabilities within 12 months.

HB Technology Co's Total Current Assets for the fiscal year that ended in Dec. 2024 is calculated as

HB Technology Co's Total Current Assets for the quarter that ended in Mar. 2025 is calculated as

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

Total Current Assets is linked to the Current Ratio, which is the result of dividing total current assets by total current liabilities. It is frequently used as an indicator of a company's liquidity, its ability to meet short-term obligations.

Total Current Assets is also linked to Working Capital, Net working capital is calculated as Total Current Assets minus Total Current Liabilities.


HB Technology Co  (XKRX:078150) Total Current Assets Explanation

In Ben Graham's calculation of liquidation value, inventory is only considered worth half of its book value, and accounts receivable is considered worth 75% of its value. Therefore the liquidation value is lower than calculated from total current assets.

HB Technology Co's Liquidation Value for the quarter that ended in Mar. 2025 is

Liquidation value
= Cash, Cash Equivalents, Marketable Securities-Total Liabilities+(0.75 * Accounts Receivable)+(0.5 * Total Inventories)
=0-91678.115+0.75 * 0+0.5 * 0
=-91,678

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


HB Technology Co Total Current Assets Related Terms

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HB Technology Co Business Description

Traded in Other Exchanges
N/A
Address
87, Sandong-ro, Eumbong-myeon, Asan-si, Chungcheongnamdo, KOR, 31419
HB Technology Co Ltd is a Korea-based semiconductor and display equipment manufacturer. It has also expanded its business area to semiconductor wafer 2D/3D inspection equipment, laser processing equipment, and display component materials. The company organizes its business operations into two divisions: Equipment Division and Components Division. Equipment Division comprises display, semiconductor and laser dicing. Components Division includes diffusion plate and light guide plate.

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