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HB Technology Co (XKRX:078150) Issuance of Debt : ₩27,065 Mil (TTM As of Dec. 2024)


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What is HB Technology Co Issuance of Debt?

HB Technology Co's Issuance of Debt for the three months ended in Dec. 2024 was ₩400 Mil.

HB Technology Co's Issuance of Debt for the trailing twelve months (TTM) ended in Dec. 2024 was ₩27,065 Mil.


HB Technology Co Issuance of Debt Historical Data

The historical data trend for HB Technology Co's Issuance of Debt can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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HB Technology Co Issuance of Debt Chart

HB Technology Co Annual Data
Trend Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23 Dec24
Issuance of Debt
Get a 7-Day Free Trial Premium Member Only Premium Member Only 11,550.89 66,636.46 499.73 - 27,065.33

HB Technology Co Quarterly Data
Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24 Dec24
Issuance of Debt Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only - 8,450.07 13,415.26 4,800.00 400.00

HB Technology Co Issuance of Debt Calculation

Issuance of Debt represents all the cash inflow from debt, including both long-term debt and short-term debt.

Issuance of Debt for the trailing twelve months (TTM) ended in Dec. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was ₩27,065 Mil.

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


HB Technology Co Issuance of Debt Related Terms

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HB Technology Co Business Description

Traded in Other Exchanges
N/A
Address
87, Sandong-ro, Eumbong-myeon, Asan-si, Chungcheongnamdo, KOR, 31419
HB Technology Co Ltd is a Korea-based semiconductor and display equipment manufacturer. It has also expanded its business area to semiconductor wafer 2D/3D inspection equipment, laser processing equipment, and display component materials. The company organizes its business operations into two divisions: Equipment Division and Components Division. Equipment Division comprises display, semiconductor and laser dicing. Components Division includes diffusion plate and light guide plate.

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