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HB Technology Co (XKRX:078150) LT-Debt-to-Total-Asset : 0.04 (As of Dec. 2024)


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What is HB Technology Co LT-Debt-to-Total-Asset?

LT Debt to Total Assets is a measurement representing the percentage of a corporation's assets that are financed with loans and financial obligations lasting more than one year. The ratio provides a general measure of the financial position of a company, including its ability to meet financial requirements for outstanding loans. It is calculated as a company's Long-Term Debt & Capital Lease Obligationdivide by its Total Assets. HB Technology Co's long-term debt to total assests ratio for the quarter that ended in Dec. 2024 was 0.04.

HB Technology Co's long-term debt to total assets ratio increased from Dec. 2023 (0.00) to Dec. 2024 (0.04). It may suggest that HB Technology Co is progressively becoming more dependent on debt to grow their business.


HB Technology Co LT-Debt-to-Total-Asset Historical Data

The historical data trend for HB Technology Co's LT-Debt-to-Total-Asset can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

HB Technology Co LT-Debt-to-Total-Asset Chart

HB Technology Co Annual Data
Trend Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23 Dec24
LT-Debt-to-Total-Asset
Get a 7-Day Free Trial Premium Member Only Premium Member Only 0.01 0.16 0.01 - 0.04

HB Technology Co Quarterly Data
Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24 Dec24
LT-Debt-to-Total-Asset Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only - - 0.03 0.03 0.04

HB Technology Co LT-Debt-to-Total-Asset Calculation

HB Technology Co's Long-Term Debt to Total Asset Ratio for the fiscal year that ended in Dec. 2024 is calculated as

LT Debt to Total Assets (A: Dec. 2024 )=Long-Term Debt & Capital Lease Obligation (A: Dec. 2024 )/Total Assets (A: Dec. 2024 )
=13326.578/348816.785
=0.04

HB Technology Co's Long-Term Debt to Total Asset Ratio for the quarter that ended in Dec. 2024 is calculated as

LT Debt to Total Assets (Q: Dec. 2024 )=Long-Term Debt & Capital Lease Obligation (Q: Dec. 2024 )/Total Assets (Q: Dec. 2024 )
=13326.578/348816.785
=0.04

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


HB Technology Co  (XKRX:078150) LT-Debt-to-Total-Asset Explanation

LT Debt to Total Asset is a measurement representing the percentage of a corporation's assets that are financed with loans and financial obligations lasting more than one year. The ratio provides a general measure of the financial position of a company, including its ability to meet financial requirements for outstanding loans. A year-over-year decrease in this metric would suggest the company is progressively becoming less dependent on debt to grow their business.


HB Technology Co LT-Debt-to-Total-Asset Related Terms

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HB Technology Co Business Description

Traded in Other Exchanges
N/A
Address
87, Sandong-ro, Eumbong-myeon, Asan-si, Chungcheongnamdo, KOR, 31419
HB Technology Co Ltd is a Korea-based semiconductor and display equipment manufacturer. It has also expanded its business area to semiconductor wafer 2D/3D inspection equipment, laser processing equipment, and display component materials. The company organizes its business operations into two divisions: Equipment Division and Components Division. Equipment Division comprises display, semiconductor and laser dicing. Components Division includes diffusion plate and light guide plate.

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