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HB Technology Co (XKRX:078150) Total Liabilities : ₩92,111 Mil (As of Dec. 2024)


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What is HB Technology Co Total Liabilities?

HB Technology Co's Total Liabilities for the quarter that ended in Dec. 2024 was ₩92,111 Mil.

HB Technology Co's quarterly Total Liabilities declined from Jun. 2024 (₩99,112.52 Mil) to Sep. 2024 (₩89,835.62 Mil) but then increased from Sep. 2024 (₩89,835.62 Mil) to Dec. 2024 (₩92,110.79 Mil).

HB Technology Co's annual Total Liabilities declined from Dec. 2022 (₩102,973.01 Mil) to Dec. 2023 (₩92,959.34 Mil) and declined from Dec. 2023 (₩92,959.34 Mil) to Dec. 2024 (₩92,110.79 Mil).


HB Technology Co Total Liabilities Historical Data

The historical data trend for HB Technology Co's Total Liabilities can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

HB Technology Co Total Liabilities Chart

HB Technology Co Annual Data
Trend Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23 Dec24
Total Liabilities
Get a 7-Day Free Trial Premium Member Only Premium Member Only 78,150.42 98,450.63 102,973.01 92,959.34 92,110.79

HB Technology Co Quarterly Data
Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24 Dec24
Total Liabilities Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 92,959.34 103,063.83 99,112.52 89,835.62 92,110.79

HB Technology Co Total Liabilities Calculation

Total Liabilities are the liabilities that the company has to pay others. It is a part of the balance sheet of a company that shareholders do not own, and would be obligated to pay back if the company liquidated.

HB Technology Co's Total Liabilities for the fiscal year that ended in Dec. 2024 is calculated as

Total Liabilities=Total Current Liabilities+Total Noncurrent Liabilities
=Total Current Liabilities+(Long-Term Debt & Capital Lease Obligation+Other Long-Term Liabilities
=64400.131+(13326.578+14076.857
+NonCurrent Deferred Liabilities+PensionAndRetirementBenefit+NonCurrent Deferred Income Tax)
+0+307.227+0)
=92,111

Total Liabilities=Total Assets (A: Dec. 2024 )-Total Equity (A: Dec. 2024 )
=348816.785-256705.992
=92,111

HB Technology Co's Total Liabilities for the quarter that ended in Dec. 2024 is calculated as

Total Liabilities=Total Current Liabilities+Total Noncurrent Liabilities
=Total Current Liabilities+(Long-Term Debt & Capital Lease Obligation+Other Long-Term Liabilities
=64400.131+(13326.578+14076.857
+NonCurrent Deferred Liabilities+PensionAndRetirementBenefit+NonCurrent Deferred Income Tax)
+0+307.227+0)
=92,111

Total Liabilities=Total Assets (Q: Dec. 2024 )-Total Equity (Q: Dec. 2024 )
=348816.785-256705.992
=92,111

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


HB Technology Co Total Liabilities Related Terms

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HB Technology Co Business Description

Traded in Other Exchanges
N/A
Address
87, Sandong-ro, Eumbong-myeon, Asan-si, Chungcheongnamdo, KOR, 31419
HB Technology Co Ltd is a Korea-based semiconductor and display equipment manufacturer. It has also expanded its business area to semiconductor wafer 2D/3D inspection equipment, laser processing equipment, and display component materials. The company organizes its business operations into two divisions: Equipment Division and Components Division. Equipment Division comprises display, semiconductor and laser dicing. Components Division includes diffusion plate and light guide plate.

HB Technology Co Headlines

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