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Unisem (M) Bhd (XKLS:5005) Institutional Ownership : 2.43% (As of Jun. 24, 2024)


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What is Unisem (M) Bhd Institutional Ownership?

Institutional ownership is the percentage of shares that are owned by institutions out of the total shares outstanding. As of today, Unisem (M) Bhd's institutional ownership is 2.43%.

Insider Ownership is the percentage of shares that are owned by company insiders relative to the total shares outstanding. As of today, Unisem (M) Bhd's Insider Ownership is 0.00%.

Float Percentage Of Total Shares Outstanding is the percentage of float shares relative to the total shares outstanding. As of today, Unisem (M) Bhd's Float Percentage Of Total Shares Outstanding is 0.00%.


Unisem (M) Bhd Institutional Ownership Historical Data

The historical data trend for Unisem (M) Bhd's Institutional Ownership can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Unisem (M) Bhd Institutional Ownership Chart

Unisem (M) Bhd Historical Data

The historical data trend for Unisem (M) Bhd can be seen below:

2023-08-31 2023-09-30 2023-10-31 2023-11-30 2023-12-31 2024-01-31 2024-02-29 2024-03-31 2024-04-30 2024-05-31
Institutional Ownership 2.90 2.90 2.84 2.83 2.64 2.63 2.63 2.50 2.44 2.42

Unisem (M) Bhd Institutional Ownership Calculation

The percentage of shares that are owned by institutions out of the total shares outstanding.


Unisem (M) Bhd (XKLS:5005) Business Description

Traded in Other Exchanges
N/A
Address
No. 1, Persiaran Pulai Jaya 9, Kawasan Perindustrian Pulai Jaya, Ipoh, MYS, 31300
Unisem (M) Bhd provides semiconductor assembly and test services in Malaysia. Its packaging and testing facilities are located in Ipoh, Perak, Malaysia, Chengdu, China, and Batam, Indonesia; and wafer bumping facilities in Ipoh, Perak, Malaysia and Chengdu, China. Unisem's assembly and test services include wafer bumping, wafer probing, wafer grinding, a range of leadframe and substrate integrated circuits packaging, wafer-level CSP (chip scale packaging), flip chip and radio frequency, analog, digital and mixed-signal testing services. Its turnkey services include design, assembly, test, failure analysis, electrical and thermal characterization, warehousing and drop-ship services. The company has a business presence in Asia, Europe and the United States of America.

Unisem (M) Bhd (XKLS:5005) Headlines

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