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Unisem (M) Bhd (XKLS:5005) Marketable Securities : RM0 Mil (As of Mar. 2024)


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What is Unisem (M) Bhd Marketable Securities?

Marketable Securities are very liquid securities that can be converted into cash quickly at a reasonable price. Unisem (M) Bhd's Marketable Securities for the quarter that ended in Mar. 2024 was RM0 Mil.


Unisem (M) Bhd Marketable Securities Historical Data

The historical data trend for Unisem (M) Bhd's Marketable Securities can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Unisem (M) Bhd Marketable Securities Chart

Unisem (M) Bhd Annual Data
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Marketable Securities
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Unisem (M) Bhd Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
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Unisem (M) Bhd Marketable Securities Calculation

Marketable Securities are very liquid securities that can be converted into cash quickly at a reasonable price.


Unisem (M) Bhd  (XKLS:5005) Marketable Securities Explanation

Marketable Securities are very liquid as they tend to have maturities of less than one year. Furthermore, the rate at which these securities can be bought or sold has little effect on their prices.

Please note, GuruFocus' Marketable Securities also includes "Other Short Term Investment".


Unisem (M) Bhd Marketable Securities Related Terms

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Unisem (M) Bhd (XKLS:5005) Business Description

Traded in Other Exchanges
N/A
Address
No. 1, Persiaran Pulai Jaya 9, Kawasan Perindustrian Pulai Jaya, Ipoh, MYS, 31300
Unisem (M) Bhd provides semiconductor assembly and test services in Malaysia. Its packaging and testing facilities are located in Ipoh, Perak, Malaysia, Chengdu, China, and Batam, Indonesia; and wafer bumping facilities in Ipoh, Perak, Malaysia and Chengdu, China. Unisem's assembly and test services include wafer bumping, wafer probing, wafer grinding, a range of leadframe and substrate integrated circuits packaging, wafer-level CSP (chip scale packaging), flip chip and radio frequency, analog, digital and mixed-signal testing services. Its turnkey services include design, assembly, test, failure analysis, electrical and thermal characterization, warehousing and drop-ship services. The company has a business presence in Asia, Europe and the United States of America.

Unisem (M) Bhd (XKLS:5005) Headlines

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