Unisem (M) Bhd (XKLS:5005) Total Receivables : RM277 Mil (As of Mar. 2024)

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What is Unisem (M) Bhd Total Receivables?

Unisem (M) Bhd's Total Receivables for the quarter that ended in Mar. 2024 was RM277 Mil.

Unisem (M) Bhd Total Receivables Historical Data

The historical data trend for Unisem (M) Bhd's Total Receivables can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Unisem (M) Bhd Total Receivables Chart

Unisem (M) Bhd Annual Data

Trend

Dec14

Dec15

Dec16

Dec17

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

Total Receivables

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148.35

172.48

190.97

220.14

187.23

Unisem (M) Bhd Quarterly Data
	Jun19	Sep19	Dec19	Mar20	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24
Total Receivables	Get a 7-Day Free Trial															196.19	216.49	187.37	187.23	277.17

Unisem (M) Bhd Total Receivables Calculation

Total Receivables is the sum of all receivables owed by customers and affiliates within one year, including:
Accounts Receivable
Notes Receivable
Loans Receivable
Other Current Receivables

Unisem (M) Bhd Total Receivables Related Terms

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Unisem (M) Bhd (XKLS:5005) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Unisem (M) Bhd (XKLS:5005) » Definitions » Total Receivables

Comparable Companies

Traded in Other Exchanges

N/A

Address

No. 1, Persiaran Pulai Jaya 9, Kawasan Perindustrian Pulai Jaya, Ipoh, MYS, 31300

Website

https://www.unisemgroup.com

Unisem (M) Bhd provides semiconductor assembly and test services in Malaysia. Its packaging and testing facilities are located in Ipoh, Perak, Malaysia, Chengdu, China, and Batam, Indonesia; and wafer bumping facilities in Ipoh, Perak, Malaysia and Chengdu, China. Unisem's assembly and test services include wafer bumping, wafer probing, wafer grinding, a range of leadframe and substrate integrated circuits packaging, wafer-level CSP (chip scale packaging), flip chip and radio frequency, analog, digital and mixed-signal testing services. Its turnkey services include design, assembly, test, failure analysis, electrical and thermal characterization, warehousing and drop-ship services. The company has a business presence in Asia, Europe and the United States of America.

Unisem (M) Bhd (XKLS:5005) Headlines

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