Unisem (M) Bhd (XKLS:5005) Change In Prepaid Assets : RM0 Mil (TTM As of Mar. 2024)

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What is Unisem (M) Bhd Change In Prepaid Assets?

Unisem (M) Bhd's Change In Prepaid Assets for the quarter that ended in Mar. 2024 was RM0 Mil. It means Unisem (M) Bhd's Prepaid Assets stayed the same from Dec. 2023 to Mar. 2024 .

Unisem (M) Bhd's Change In Prepaid Assets for the fiscal year that ended in Dec. 2023 was RM0 Mil. It means Unisem (M) Bhd's Prepaid Assets stayed the same from Dec. 2022 to Dec. 2023 .

Unisem (M) Bhd Change In Prepaid Assets Historical Data

The historical data trend for Unisem (M) Bhd's Change In Prepaid Assets can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Unisem (M) Bhd Change In Prepaid Assets Chart

Unisem (M) Bhd Annual Data

Trend

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Change In Prepaid Assets

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Unisem (M) Bhd Quarterly Data
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Unisem (M) Bhd Change In Prepaid Assets Calculation

Change In Prepaid Assets is any increase or decrease between periods of the prepaid assets.

Change In Prepaid Assets for the trailing twelve months (TTM) ended in Mar. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was RM0 Mil.

Unisem (M) Bhd Change In Prepaid Assets Related Terms

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Unisem (M) Bhd (XKLS:5005) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Unisem (M) Bhd (XKLS:5005) » Definitions » Change In Prepaid Assets

Comparable Companies

Traded in Other Exchanges

N/A

Address

No. 1, Persiaran Pulai Jaya 9, Kawasan Perindustrian Pulai Jaya, Ipoh, MYS, 31300

Website

https://www.unisemgroup.com

Unisem (M) Bhd provides semiconductor assembly and test services in Malaysia. Its packaging and testing facilities are located in Ipoh, Perak, Malaysia, Chengdu, China, and Batam, Indonesia; and wafer bumping facilities in Ipoh, Perak, Malaysia and Chengdu, China. Unisem's assembly and test services include wafer bumping, wafer probing, wafer grinding, a range of leadframe and substrate integrated circuits packaging, wafer-level CSP (chip scale packaging), flip chip and radio frequency, analog, digital and mixed-signal testing services. Its turnkey services include design, assembly, test, failure analysis, electrical and thermal characterization, warehousing and drop-ship services. The company has a business presence in Asia, Europe and the United States of America.

Unisem (M) Bhd (XKLS:5005) Headlines

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