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Unisem (M) Bhd (XKLS:5005) Other Current Payables : RM0 Mil (As of Mar. 2024)


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What is Unisem (M) Bhd Other Current Payables?

Unisem (M) Bhd's Other Current Payables for the quarter that ended in Mar. 2024 was RM0 Mil.

Unisem (M) Bhd's quarterly Other Current Payables increased from Sep. 2023 (RM0 Mil) to Dec. 2023 (RM126 Mil) but then declined from Dec. 2023 (RM126 Mil) to Mar. 2024 (RM0 Mil).

Unisem (M) Bhd's annual Other Current Payables declined from Dec. 2021 (RM188 Mil) to Dec. 2022 (RM138 Mil) and declined from Dec. 2022 (RM138 Mil) to Dec. 2023 (RM126 Mil).


Unisem (M) Bhd Other Current Payables Historical Data

The historical data trend for Unisem (M) Bhd's Other Current Payables can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Unisem (M) Bhd Other Current Payables Chart

Unisem (M) Bhd Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Other Current Payables
Get a 7-Day Free Trial Premium Member Only Premium Member Only 79.56 104.69 187.82 138.19 125.81

Unisem (M) Bhd Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
Other Current Payables Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 0.06 0.19 0.14 125.81 0.21

Unisem (M) Bhd Other Current Payables Calculation

Other Current Payables is the payables owed and expected to be paid within one year or one operating cycle that not otherwise classified. It includes dividends payable and all other current payables.


Unisem (M) Bhd Other Current Payables Related Terms

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Unisem (M) Bhd (XKLS:5005) Business Description

Traded in Other Exchanges
N/A
Address
No. 1, Persiaran Pulai Jaya 9, Kawasan Perindustrian Pulai Jaya, Ipoh, MYS, 31300
Unisem (M) Bhd provides semiconductor assembly and test services in Malaysia. Its packaging and testing facilities are located in Ipoh, Perak, Malaysia, Chengdu, China, and Batam, Indonesia; and wafer bumping facilities in Ipoh, Perak, Malaysia and Chengdu, China. Unisem's assembly and test services include wafer bumping, wafer probing, wafer grinding, a range of leadframe and substrate integrated circuits packaging, wafer-level CSP (chip scale packaging), flip chip and radio frequency, analog, digital and mixed-signal testing services. Its turnkey services include design, assembly, test, failure analysis, electrical and thermal characterization, warehousing and drop-ship services. The company has a business presence in Asia, Europe and the United States of America.

Unisem (M) Bhd (XKLS:5005) Headlines

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