Unisem (M) Bhd (XKLS:5005) Treasury Stock : RM0 Mil (As of Jun. 2024)

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What is Unisem (M) Bhd Treasury Stock?

Treasury stock is the portion of shares that a company keeps in their own treasury. Unisem (M) Bhd's treasury stock for the quarter that ended in Jun. 2024 was RM0 Mil.

Treasury stock may have come from a repurchase or buyback from shareholders; or it may have never been issued to the public in the first place.

Unisem (M) Bhd Treasury Stock Historical Data

The historical data trend for Unisem (M) Bhd's Treasury Stock can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Unisem (M) Bhd Treasury Stock Chart

Unisem (M) Bhd Annual Data

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Treasury Stock

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-15.89

Unisem (M) Bhd Quarterly Data
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Treasury Stock	Get a 7-Day Free Trial															-	-	-	-	-

Unisem (M) Bhd Treasury Stock Calculation

The portion of shares that a company keeps in their own treasury. Treasury stock may have come from a repurchase or buyback from shareholders; or it may have never been issued to the public in the first place. These shares don't pay dividends, have no voting rights, and should not be included in shares outstanding calculations.

Unisem (M) Bhd Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Unisem (M) Bhd (XKLS:5005) » Definitions » Treasury Stock

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Traded in Other Exchanges

N/A

Address

No. 1, Persiaran Pulai Jaya 9, Kawasan Perindustrian Pulai Jaya, Ipoh, MYS, 31300

Website

https://www.unisemgroup.com

Unisem (M) Bhd provides semiconductor assembly and test services in Malaysia. Its packaging and testing facilities are located in Ipoh, Perak, Malaysia, Chengdu, China, and Batam, Indonesia; and wafer bumping facilities in Ipoh, Perak, Malaysia and Chengdu, China. Unisem's assembly and test services include wafer bumping, wafer probing, wafer grinding, a range of leadframe and substrate integrated circuits packaging, wafer-level CSP (chip scale packaging), flip chip and radio frequency, analog, digital and mixed-signal testing services. Its turnkey services include design, assembly, test, failure analysis, electrical and thermal characterization, warehousing and drop-ship services. The company has a business presence in Asia, Europe and the United States of America.

Unisem (M) Bhd Headlines

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