Unisem (M) Bhd (XKLS:5005) Other Current Liabilities : RM6 Mil (As of Jun. 2024)

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What is Unisem (M) Bhd Other Current Liabilities?

Unisem (M) Bhd's other current liabilities for the quarter that ended in Jun. 2024 was RM6 Mil.

Unisem (M) Bhd's quarterly other current liabilities declined from Dec. 2023 (RM56 Mil) to Mar. 2024 (RM13 Mil) and declined from Mar. 2024 (RM13 Mil) to Jun. 2024 (RM6 Mil).

Unisem (M) Bhd's annual other current liabilities increased from Dec. 2021 (RM60 Mil) to Dec. 2022 (RM71 Mil) but then declined from Dec. 2022 (RM71 Mil) to Dec. 2023 (RM56 Mil).

Unisem (M) Bhd Other Current Liabilities Historical Data

The historical data trend for Unisem (M) Bhd's Other Current Liabilities can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Unisem (M) Bhd Other Current Liabilities Chart

Unisem (M) Bhd Annual Data

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Other Current Liabilities

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Unisem (M) Bhd Quarterly Data
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Other Current Liabilities	Get a 7-Day Free Trial															-	-	-	-	-

Unisem (M) Bhd Other Current Liabilities Calculation

The liability a company needs to pay in the next 12 months, but not assigned to Accounts Payable or Debt. For instance, Wal-Mart (WMT) has accrued wages, salaries, valuation, bonuses, insurance liabilities, accrued tax etc. These are all included in other current liabilities.

Unisem (M) Bhd Other Current Liabilities Related Terms

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Unisem (M) Bhd Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Unisem (M) Bhd (XKLS:5005) » Definitions » Other Current Liabilities

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Address

No. 1, Persiaran Pulai Jaya 9, Kawasan Perindustrian Pulai Jaya, Ipoh, MYS, 31300

Website

https://www.unisemgroup.com

Unisem (M) Bhd provides semiconductor assembly and test services in Malaysia. Its packaging and testing facilities are located in Ipoh, Perak, Malaysia, Chengdu, China, and Batam, Indonesia; and wafer bumping facilities in Ipoh, Perak, Malaysia and Chengdu, China. Unisem's assembly and test services include wafer bumping, wafer probing, wafer grinding, a range of leadframe and substrate integrated circuits packaging, wafer-level CSP (chip scale packaging), flip chip and radio frequency, analog, digital and mixed-signal testing services. Its turnkey services include design, assembly, test, failure analysis, electrical and thermal characterization, warehousing and drop-ship services. The company has a business presence in Asia, Europe and the United States of America.

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