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Unisem (M) Bhd (XKLS:5005) Short-Term Debt : RM56 Mil (As of Mar. 2024)


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What is Unisem (M) Bhd Short-Term Debt?

Unisem (M) Bhd's Short-Term Debt for the quarter that ended in Mar. 2024 was RM56 Mil.

Unisem (M) Bhd's quarterly Short-Term Debt declined from Sep. 2023 (RM165 Mil) to Dec. 2023 (RM90 Mil) and declined from Dec. 2023 (RM90 Mil) to Mar. 2024 (RM56 Mil).

Unisem (M) Bhd's annual Short-Term Debt increased from Dec. 2021 (RM119 Mil) to Dec. 2022 (RM163 Mil) but then declined from Dec. 2022 (RM163 Mil) to Dec. 2023 (RM90 Mil).


Unisem (M) Bhd Short-Term Debt Historical Data

The historical data trend for Unisem (M) Bhd's Short-Term Debt can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Unisem (M) Bhd Short-Term Debt Chart

Unisem (M) Bhd Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Short-Term Debt
Get a 7-Day Free Trial Premium Member Only Premium Member Only 53.47 98.84 118.68 163.46 89.56

Unisem (M) Bhd Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
Short-Term Debt Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 131.40 165.42 165.35 89.56 55.88

Unisem (M) Bhd Short-Term Debt Explanation

Short-Term Debt represents the total amount of Long-Term Debt such as bank loans and commercial paper, which is due within one year.


Unisem (M) Bhd Short-Term Debt Related Terms

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Unisem (M) Bhd (XKLS:5005) Business Description

Traded in Other Exchanges
N/A
Address
No. 1, Persiaran Pulai Jaya 9, Kawasan Perindustrian Pulai Jaya, Ipoh, MYS, 31300
Unisem (M) Bhd provides semiconductor assembly and test services in Malaysia. Its packaging and testing facilities are located in Ipoh, Perak, Malaysia, Chengdu, China, and Batam, Indonesia; and wafer bumping facilities in Ipoh, Perak, Malaysia and Chengdu, China. Unisem's assembly and test services include wafer bumping, wafer probing, wafer grinding, a range of leadframe and substrate integrated circuits packaging, wafer-level CSP (chip scale packaging), flip chip and radio frequency, analog, digital and mixed-signal testing services. Its turnkey services include design, assembly, test, failure analysis, electrical and thermal characterization, warehousing and drop-ship services. The company has a business presence in Asia, Europe and the United States of America.

Unisem (M) Bhd (XKLS:5005) Headlines

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