Unisem (M) Bhd (XKLS:5005) Asset Impairment Charge : RM0 Mil (TTM As of Mar. 2024)

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What is Unisem (M) Bhd Asset Impairment Charge?

Unisem (M) Bhd's Asset Impairment Charge for the three months ended in Mar. 2024 was RM0 Mil. Its Asset Impairment Charge for the trailing twelve months (TTM) ended in Mar. 2024 was RM0 Mil.

Unisem (M) Bhd Asset Impairment Charge Historical Data

The historical data trend for Unisem (M) Bhd's Asset Impairment Charge can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Unisem (M) Bhd Asset Impairment Charge Chart

Unisem (M) Bhd Annual Data

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Asset Impairment Charge

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Unisem (M) Bhd Quarterly Data
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Unisem (M) Bhd Asset Impairment Charge Calculation

Asset Impairment Charge is the charge against earnings resulting from the aggregate write down of all assets from their carrying value to their fair value.

Asset Impairment Charge for the trailing twelve months (TTM) ended in Mar. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was RM0 Mil.

Unisem (M) Bhd Asset Impairment Charge Related Terms

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Unisem (M) Bhd (XKLS:5005) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Unisem (M) Bhd (XKLS:5005) » Definitions » Asset Impairment Charge

Comparable Companies

Traded in Other Exchanges

N/A

Address

No. 1, Persiaran Pulai Jaya 9, Kawasan Perindustrian Pulai Jaya, Ipoh, MYS, 31300

Website

https://www.unisemgroup.com

Unisem (M) Bhd provides semiconductor assembly and test services in Malaysia. Its packaging and testing facilities are located in Ipoh, Perak, Malaysia, Chengdu, China, and Batam, Indonesia; and wafer bumping facilities in Ipoh, Perak, Malaysia and Chengdu, China. Unisem's assembly and test services include wafer bumping, wafer probing, wafer grinding, a range of leadframe and substrate integrated circuits packaging, wafer-level CSP (chip scale packaging), flip chip and radio frequency, analog, digital and mixed-signal testing services. Its turnkey services include design, assembly, test, failure analysis, electrical and thermal characterization, warehousing and drop-ship services. The company has a business presence in Asia, Europe and the United States of America.

Unisem (M) Bhd (XKLS:5005) Headlines

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