Unisem (M) Bhd (XKLS:5005) NonCurrent Deferred Liabilities : RM0 Mil (As of Mar. 2024)

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What is Unisem (M) Bhd NonCurrent Deferred Liabilities?

Non-Current Deferred Liabilities represents the non-current portion of obligations, which is a liability that usually would have been paid but is now pas due.

Unisem (M) Bhd's non-current deferred liabilities for the quarter that ended in Mar. 2024 was RM0 Mil.

Unisem (M) Bhd NonCurrent Deferred Liabilities Historical Data

The historical data trend for Unisem (M) Bhd's NonCurrent Deferred Liabilities can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Unisem (M) Bhd NonCurrent Deferred Liabilities Chart

Unisem (M) Bhd Annual Data

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NonCurrent Deferred Liabilities

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Unisem (M) Bhd Quarterly Data
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Unisem (M) Bhd (XKLS:5005) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Unisem (M) Bhd (XKLS:5005) » Definitions » NonCurrent Deferred Liabilities

Comparable Companies

Traded in Other Exchanges

N/A

Address

No. 1, Persiaran Pulai Jaya 9, Kawasan Perindustrian Pulai Jaya, Ipoh, MYS, 31300

Website

https://www.unisemgroup.com

Unisem (M) Bhd provides semiconductor assembly and test services in Malaysia. Its packaging and testing facilities are located in Ipoh, Perak, Malaysia, Chengdu, China, and Batam, Indonesia; and wafer bumping facilities in Ipoh, Perak, Malaysia and Chengdu, China. Unisem's assembly and test services include wafer bumping, wafer probing, wafer grinding, a range of leadframe and substrate integrated circuits packaging, wafer-level CSP (chip scale packaging), flip chip and radio frequency, analog, digital and mixed-signal testing services. Its turnkey services include design, assembly, test, failure analysis, electrical and thermal characterization, warehousing and drop-ship services. The company has a business presence in Asia, Europe and the United States of America.

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