Unisem (M) Bhd (XKLS:5005) PensionAndRetirementBenefit : RM0 Mil (As of Mar. 2024)

View and export this data going back to 2000. Start your Free Trial

What is Unisem (M) Bhd PensionAndRetirementBenefit?

Unisem (M) Bhd's PensionAndRetirementBenefit for the quarter that ended in Mar. 2024 was RM0 Mil.

Unisem (M) Bhd PensionAndRetirementBenefit Historical Data

The historical data trend for Unisem (M) Bhd's PensionAndRetirementBenefit can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Unisem (M) Bhd PensionAndRetirementBenefit Chart

Unisem (M) Bhd Annual Data

Trend

Dec14

Dec15

Dec16

Dec17

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

PensionAndRetirementBenefit

Get a 7-Day Free Trial

Unisem (M) Bhd Quarterly Data
	Jun19	Sep19	Dec19	Mar20	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24
PensionAndRetirementBenefit	Get a 7-Day Free Trial															-	-	-	-	-

Unisem (M) Bhd PensionAndRetirementBenefit Calculation

PensionAndRetirementBenefit is the carrying amount as of the balance sheet date of the portion of the obligations recognized for the various benefits provided to former or inactive employees, their beneficiaries, and covered dependents after employment but before retirement.

Unisem (M) Bhd (XKLS:5005) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Unisem (M) Bhd (XKLS:5005) » Definitions » PensionAndRetirementBenefit

Comparable Companies

Traded in Other Exchanges

N/A

Address

No. 1, Persiaran Pulai Jaya 9, Kawasan Perindustrian Pulai Jaya, Ipoh, MYS, 31300

Website

https://www.unisemgroup.com

Unisem (M) Bhd provides semiconductor assembly and test services in Malaysia. Its packaging and testing facilities are located in Ipoh, Perak, Malaysia, Chengdu, China, and Batam, Indonesia; and wafer bumping facilities in Ipoh, Perak, Malaysia and Chengdu, China. Unisem's assembly and test services include wafer bumping, wafer probing, wafer grinding, a range of leadframe and substrate integrated circuits packaging, wafer-level CSP (chip scale packaging), flip chip and radio frequency, analog, digital and mixed-signal testing services. Its turnkey services include design, assembly, test, failure analysis, electrical and thermal characterization, warehousing and drop-ship services. The company has a business presence in Asia, Europe and the United States of America.

Unisem (M) Bhd (XKLS:5005) Headlines

No Headlines