Unisem (M) Bhd (XKLS:5005) Short-Term Capital Lease Obligation : RM0 Mil (As of Mar. 2024)

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What is Unisem (M) Bhd Short-Term Capital Lease Obligation?

Unisem (M) Bhd's Short-Term Capital Lease Obligation for the quarter that ended in Mar. 2024 was RM0 Mil.

Unisem (M) Bhd Short-Term Capital Lease Obligation Historical Data

The historical data trend for Unisem (M) Bhd's Short-Term Capital Lease Obligation can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Unisem (M) Bhd Short-Term Capital Lease Obligation Chart

Unisem (M) Bhd Annual Data

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Short-Term Capital Lease Obligation

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Unisem (M) Bhd Quarterly Data
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Unisem (M) Bhd Short-Term Capital Lease Obligation Explanation

Short-Term Capital Lease Obligation represents the total amount of Long-Term Capital Lease Obligation that must be paid within the next accounting period. Capital lease obligations are contractual obligations that arise from obtaining the use of property or equipment via a capital lease contract.

Unisem (M) Bhd Short-Term Capital Lease Obligation Related Terms

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Unisem (M) Bhd (XKLS:5005) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Unisem (M) Bhd (XKLS:5005) » Definitions » Short-Term Capital Lease Obligation

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Traded in Other Exchanges

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Address

No. 1, Persiaran Pulai Jaya 9, Kawasan Perindustrian Pulai Jaya, Ipoh, MYS, 31300

Website

https://www.unisemgroup.com

Unisem (M) Bhd provides semiconductor assembly and test services in Malaysia. Its packaging and testing facilities are located in Ipoh, Perak, Malaysia, Chengdu, China, and Batam, Indonesia; and wafer bumping facilities in Ipoh, Perak, Malaysia and Chengdu, China. Unisem's assembly and test services include wafer bumping, wafer probing, wafer grinding, a range of leadframe and substrate integrated circuits packaging, wafer-level CSP (chip scale packaging), flip chip and radio frequency, analog, digital and mixed-signal testing services. Its turnkey services include design, assembly, test, failure analysis, electrical and thermal characterization, warehousing and drop-ship services. The company has a business presence in Asia, Europe and the United States of America.

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