Unisem (M) Bhd (XKLS:5005) Research & Development : RM0 Mil (TTM As of Mar. 2024)

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What is Unisem (M) Bhd Research & Development?

Research & Development is the aggregate amount of research and development expenses during the year. Unisem (M) Bhd's Research & Development for the three months ended in Mar. 2024 was RM0 Mil. Its Research & Development for the trailing twelve months (TTM) ended in Mar. 2024 was RM0 Mil.

Unisem (M) Bhd Research & Development Historical Data

The historical data trend for Unisem (M) Bhd's Research & Development can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Unisem (M) Bhd Research & Development Chart

Unisem (M) Bhd Annual Data

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Research & Development

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Unisem (M) Bhd Quarterly Data
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Research & Development	Get a 7-Day Free Trial															-	-	-	-	-

Unisem (M) Bhd Research & Development Calculation

This is the expense the company spent on research and development.

Research & Development for the trailing twelve months (TTM) ended in Mar. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was RM0 Mil.

Unisem (M) Bhd (XKLS:5005) Research & Development Explanation

If competitive advantage is created by a patent or tech advantage, at some point it will disappear.

High R&D usually dictates high SG&A which threatens the competitive advantage.

Unisem (M) Bhd Research & Development Related Terms

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Unisem (M) Bhd (XKLS:5005) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Unisem (M) Bhd (XKLS:5005) » Definitions » Research & Development

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Traded in Other Exchanges

N/A

Address

No. 1, Persiaran Pulai Jaya 9, Kawasan Perindustrian Pulai Jaya, Ipoh, MYS, 31300

Website

https://www.unisemgroup.com

Unisem (M) Bhd provides semiconductor assembly and test services in Malaysia. Its packaging and testing facilities are located in Ipoh, Perak, Malaysia, Chengdu, China, and Batam, Indonesia; and wafer bumping facilities in Ipoh, Perak, Malaysia and Chengdu, China. Unisem's assembly and test services include wafer bumping, wafer probing, wafer grinding, a range of leadframe and substrate integrated circuits packaging, wafer-level CSP (chip scale packaging), flip chip and radio frequency, analog, digital and mixed-signal testing services. Its turnkey services include design, assembly, test, failure analysis, electrical and thermal characterization, warehousing and drop-ship services. The company has a business presence in Asia, Europe and the United States of America.

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