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Chipbond Technology (ROCO:6147) Accounts Payable : NT$625 Mil (As of Mar. 2024)


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What is Chipbond Technology Accounts Payable?

Chipbond Technology's Accounts Payable for the quarter that ended in Mar. 2024 was NT$625 Mil.

Chipbond Technology's quarterly Accounts Payable declined from Sep. 2023 (NT$698 Mil) to Dec. 2023 (NT$679 Mil) and declined from Dec. 2023 (NT$679 Mil) to Mar. 2024 (NT$625 Mil).

Chipbond Technology's annual Accounts Payable declined from Dec. 2021 (NT$874 Mil) to Dec. 2022 (NT$723 Mil) and declined from Dec. 2022 (NT$723 Mil) to Dec. 2023 (NT$679 Mil).


Chipbond Technology Accounts Payable Historical Data

The historical data trend for Chipbond Technology's Accounts Payable can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Chipbond Technology Accounts Payable Chart

Chipbond Technology Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Accounts Payable
Get a 7-Day Free Trial Premium Member Only Premium Member Only 752.09 963.08 874.17 723.14 678.68

Chipbond Technology Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
Accounts Payable Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 669.77 722.57 698.40 678.68 625.50

Chipbond Technology Accounts Payable Calculation

Accounts Payable represents any money that a company owes its suppliers for goods and services purchased on credit and is expected to pay within the next year or operating cycle.


Chipbond Technology Accounts Payable Related Terms

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Chipbond Technology (ROCO:6147) Business Description

Traded in Other Exchanges
N/A
Address
No 3, Li Hsin 5th Road, Hsinchu Science Park, Hsinchu, TWN, 300
Chipbond Technology Corp along is engaged in the research, development, manufacturing, and sale of driver IC and non-driver IC packaging and testing services.

Chipbond Technology (ROCO:6147) Headlines

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