Chipbond Technology (ROCO:6147) Total Operating Expense : NT$1,968 Mil (TTM As of Mar. 2025)

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What is Chipbond Technology Total Operating Expense?

Chipbond Technology's Total Operating Expense for the three months ended in Mar. 2025 was NT$474 Mil. Chipbond Technology's Total Operating Expense for the trailing twelve months (TTM) ended in Mar. 2025 was NT$1,968 Mil.

Chipbond Technology Total Operating Expense Historical Data

The historical data trend for Chipbond Technology's Total Operating Expense can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Chipbond Technology Total Operating Expense Chart

Chipbond Technology Annual Data

Trend

Dec15

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Dec24

Total Operating Expense

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1,445.26

1,857.75

1,956.18

1,800.08

2,026.83

Chipbond Technology Quarterly Data
	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24	Jun24	Sep24	Dec24	Mar25
Total Operating Expense	Get a 7-Day Free Trial															532.87	510.84	485.41	497.70	474.46

Chipbond Technology Total Operating Expense Calculation

Total Operating Expense is the primary recurring expense associated with central operations that are incurred in order to generate sales.

Total Operating Expense for the trailing twelve months (TTM) ended in Mar. 2025 adds up the quarterly data reported by the company within the most recent 12 months, which was NT$1,968 Mil.

Chipbond Technology Total Operating Expense Related Terms

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Chipbond Technology Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Chipbond Technology Corp (ROCO:6147) » Definitions » Total Operating Expense

Comparable Companies

Traded in Other Exchanges

N/A

Address

No 3, Li Hsin 5th Road, Hsinchu Science Park, Hsinchu, TWN, 300094

Website

https://www.chipbond.com.tw

Chipbond Technology Corp is engaged in the research, development, manufacturing, and sale of driver IC and non-driver IC packaging and testing services. The products and services offered by the company include, Chip Tray, SiGe Wafer, SiC Wafer, Gold Bumping services, Packaging attachment services among others.

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