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Chipbond Technology (ROCO:6147) Margin of Safety % (DCF Dividends Based) : N/A (As of Jun. 22, 2024)


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What is Chipbond Technology Margin of Safety % (DCF Dividends Based)?

Margin of Safety % (DCF Dividends Based) = (Intrinsic Value: DCF (Dividends Based) - Current Price) / Intrinsic Value: DCF (Dividends Based).

Note: Discounted Dividend model is only suitable for companies who have a consistant distribution history with more than 5 years. If the company's dividends does not remain steady over a long period, results may not be accurate due to the low consistency. The model is also only suitable for predictable companies (Business Predictability Rank higher than 1-Star). If the company's Predictability Rank is 1-Star or Not Rated, the data will not be stored into our database.

Chipbond Technology's Predictability Rank is 1-Star. Thus, the DCF related results in the screener and portfolio will appear as zero and Margin of Safety % (DCF Dividends Based) is not calculated.


Competitive Comparison of Chipbond Technology's Margin of Safety % (DCF Dividends Based)

For the Semiconductor Equipment & Materials subindustry, Chipbond Technology's Margin of Safety % (DCF Dividends Based), along with its competitors' market caps and Margin of Safety % (DCF Dividends Based) data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Chipbond Technology's Margin of Safety % (DCF Dividends Based) Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, Chipbond Technology's Margin of Safety % (DCF Dividends Based) distribution charts can be found below:

* The bar in red indicates where Chipbond Technology's Margin of Safety % (DCF Dividends Based) falls into.



Chipbond Technology Margin of Safety % (DCF Dividends Based) Related Terms

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Chipbond Technology (ROCO:6147) Business Description

Industry
Traded in Other Exchanges
N/A
Address
No 3, Li Hsin 5th Road, Hsinchu Science Park, Hsinchu, TWN, 300
Chipbond Technology Corp along is engaged in the research, development, manufacturing, and sale of driver IC and non-driver IC packaging and testing services.

Chipbond Technology (ROCO:6147) Headlines

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