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Chipbond Technology (ROCO:6147) Credit Losses Provision


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What is Chipbond Technology Credit Losses Provision?

Credit Losses Provision only applies to banks.


Chipbond Technology Business Description

Traded in Other Exchanges
N/A
Address
No 3, Li Hsin 5th Road, Hsinchu Science Park, Hsinchu, TWN, 300094
Chipbond Technology Corp is engaged in the research, development, manufacturing, and sale of driver IC and non-driver IC packaging and testing services. The products and services offered by the company include, Chip Tray, SiGe Wafer, SiC Wafer, Gold Bumping services, Packaging attachment services among others.